Difference between revisions of "SB-6E Bonder"
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| − | This tool is used to bond 4" and 6" wafers. It is primarily used for [[Anodic bonding|anodic bonding]] and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding. | + | This tool is used to bond 4" wafers, (and in some circumstances be configured for 6" wafers). It is primarily used for [[Anodic bonding|anodic bonding]] and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding. |
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==Capabilities== | ==Capabilities== | ||
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* Chamber vacuum below 5.0e-5 mbar easily achieved | * Chamber vacuum below 5.0e-5 mbar easily achieved | ||
* Tool force of 30 kN | * Tool force of 30 kN | ||
| − | * Max chuck temp of | + | * Max chuck temp of 500°C |
* Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval. | * Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval. | ||
==System overview== | ==System overview== | ||
===Hardware details=== | ===Hardware details=== | ||
| − | * Up to | + | * Up to 500 °C chuck temp |
* 30 kN tool Pressure | * 30 kN tool Pressure | ||
* 4" Chuck, 6" available by request | * 4" Chuck, 6" available by request | ||
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<!-- Describe the checkout procedure for the tool. For example: --> | <!-- Describe the checkout procedure for the tool. For example: --> | ||
# Read through this page and the Standard Operating Procedure above. | # Read through this page and the Standard Operating Procedure above. | ||
| − | + | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training, and to review your process needs. | |
| − | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training. | + | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] requesting checkout. |
| − | # | + | # Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer. |
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Revision as of 15:37, 5 August 2021
| SB-6E Bonder | |
|---|---|
 | |
| Equipment Details | |
| Technology | Wafer bonding |
| Materials Restriction | Semi-Clean |
| Material Processed | silicon, glass |
| Sample Size | 4" with 6" tooling available by request |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
 Warning: | This page has not been released yet. |
This tool is used to bond 4" wafers, (and in some circumstances be configured for 6" wafers). It is primarily used for anodic bonding and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.
Contents
Capabilities
- Chamber vacuum below 5.0e-5 mbar easily achieved
- Tool force of 30 kN
- Max chuck temp of 500°C
- Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval.
System overview
Hardware details
- Up to 500 °C chuck temp
- 30 kN tool Pressure
- 4" Chuck, 6" available by request
- Chamber pressure below 5.0 e-5 mbar. Positive chamber pressure also available
- N2 atmosphere possible in chamber
Substrate requirements
- 4" round. 6" round by request
- Si and glass wafers allowed
- Wafer thickness between 500 µm and 5 mm with tool engineer discussion
Material restrictions
The approved materials listed for the SB-6E Bonder are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the #supported processes section. For any other materials, please create a helpdesk ticket.
The SB-6E Bonder is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Approved materials
Supported processes
Anodic bonding of Si to glass is primarily supported on this tool. Other materials are allowed for other bonds also if requested. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
Widget text will go here.
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Create a Helpdesk Ticket requesting training, and to review your process needs.
- Create a helpdesk ticket requesting checkout.
- Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
