Difference between revisions of "SB-6E Bonder"

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--> {{#vardefine:toolid|141031}} <!--  
 
--> {{#vardefine:toolid|141031}} <!--  
 
Set the Process Technology (see subcategories on Equipment page)  
 
Set the Process Technology (see subcategories on Equipment page)  
--> {{#vardefine:technology|substrate bonder}} <!--
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--> {{#vardefine:technology|Wafer bonding}} <!--
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
--> {{#vardefine:restriction|2}}
 
--> {{#vardefine:restriction|2}}
 
{{infobox equipment
 
{{infobox equipment
 
|caption =  
 
|caption =  
|materials =  
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|materials = silicon, glass
 
|mask =
 
|mask =
 
|size =4" with 6" tooling available by request
 
|size =4" with 6" tooling available by request
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|gases =  
 
|gases =  
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
|sop = [https://link.to.google.doc/preview SOP]
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|sop = [https://https://docs.google.com/document/d/11-10RByKRXwGFFQkXfpMJ2941cK9UDBYZ4qgCdn3630/preview SOP]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
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{{warning|This page has not been released yet.}}
 
{{warning|This page has not been released yet.}}
  
This tool is used to bond 4" and 6" wafers.  It is primarily used for Anodic bonding and has superior anodic bond hardware when compared to our other bonders.  Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers.  Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.   
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This tool is used to bond 4" wafers, (and in some circumstances be configured for 6" wafers).  It is primarily used for [[Anodic bonding|anodic bonding]] and has superior anodic bond hardware when compared to our other bonders.  Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers.  Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.   
  
==Announcements==
 
*Update this with announcements as necessary
 
  
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* Chamber vacuum below 5.0e-5mbar easily achieved
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* Chamber vacuum below 5.0e-5 mbar easily achieved
* Tool force of 30kN
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* Tool force of 30 kN
* Max chuck temp of 550 degrees C
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* Max chuck temp of 500°C
* Substrate stack thicknesses of 500um to 5mm possible.  Thinner or thicker with tool engineer approval.
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* Substrate stack thicknesses of 500 um to 5 mm possible.  Thinner or thicker with tool engineer approval.
  
 
==System overview==
 
==System overview==
 
===Hardware details===
 
===Hardware details===
* Up to 550 degrees C chuck temp
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* Up to 500 °C chuck temp
* 30kN tool Pressure
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* 30 kN tool Pressure
 
* 4" Chuck, 6" available by request
 
* 4" Chuck, 6" available by request
* Chamber pressure below 5.0 e-5mbar.  Positive chamber pressure also available
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* Chamber pressure below 5.0 e-5 mbar.  Positive chamber pressure also available
 
* N2 atmosphere possible  in chamber
 
* N2 atmosphere possible  in chamber
  
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* 4" round.  6" round by request
 
* 4" round.  6" round by request
 
* Si and glass wafers allowed
 
* Si and glass wafers allowed
* Wafer thickness between 500um and 5mm with tool engineer discussion
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* Wafer thickness between 500 µm and 5 mm with tool engineer discussion
  
 
===Material restrictions===
 
===Material restrictions===
 +
{{note|The approved materials listed for the {{PAGENAME}} are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the [[#supported processes]] section. For any other materials, please create a helpdesk ticket. }}
 
{{material restrictions}}
 
{{material restrictions}}
  
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<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
  
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
 
  
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
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Anodic bonding of Si to glass is primarily supported on this tool. Other materials are allowed for other bonds also if requested. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
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 +
<!--There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.-->
  
 
==Standard operating procedure==
 
==Standard operating procedure==
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<!-- Describe the checkout procedure for the tool. For example: -->
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
# Read through this page and the Standard Operating Procedure above.
 
# Read through this page and the Standard Operating Procedure above.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training, and to review your process needs.
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] requesting checkout.
# A tool engineer will schedule a time for training and/or checkout.
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# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
 
 
==Maintenance==
 
needs maintenance done and stuff
 
 
 
===Process name===
 
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
 
{{#widget:Iframe
 
|url=chart url
 
|width=800
 
|height=400
 
|border=0
 
}}
 

Latest revision as of 15:37, 5 August 2021

SB-6E Bonder
141031.jpg
Equipment Details
Technology Wafer bonding
Materials Restriction Semi-Clean
Material Processed silicon, glass
Sample Size 4" with 6" tooling available by request
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

This tool is used to bond 4" wafers, (and in some circumstances be configured for 6" wafers). It is primarily used for anodic bonding and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.


Capabilities

  • Chamber vacuum below 5.0e-5 mbar easily achieved
  • Tool force of 30 kN
  • Max chuck temp of 500°C
  • Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval.

System overview

Hardware details

  • Up to 500 °C chuck temp
  • 30 kN tool Pressure
  • 4" Chuck, 6" available by request
  • Chamber pressure below 5.0 e-5 mbar. Positive chamber pressure also available
  • N2 atmosphere possible in chamber

Substrate requirements

  • 4" round. 6" round by request
  • Si and glass wafers allowed
  • Wafer thickness between 500 µm and 5 mm with tool engineer discussion

Material restrictions

The approved materials listed for the SB-6E Bonder are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the #supported processes section. For any other materials, please create a helpdesk ticket.

The SB-6E Bonder is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

Anodic bonding of Si to glass is primarily supported on this tool. Other materials are allowed for other bonds also if requested. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.


Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training, and to review your process needs.
  3. Create a helpdesk ticket requesting checkout.
  4. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.