Difference between revisions of "SB-6E Bonder"

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Set the Process Technology (see subcategories on Equipment page)  
 
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Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
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This tool is used to bond 4" and 6" wafers.  It is primarily used for [[Anodic bonding|anodic bonding]] and has superior anodic bond hardware when compared to our other bonders.  Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers.  Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.   
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This tool is used to bond 4" wafers, (and in some circumstances be configured for 6" wafers).  It is primarily used for [[Anodic bonding|anodic bonding]] and has superior anodic bond hardware when compared to our other bonders.  Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers.  Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.   
  
==Announcements==
 
* None at this time
 
  
 
==Capabilities==
 
==Capabilities==
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* Chamber vacuum below 5.0e-5 mbar easily achieved
 
* Chamber vacuum below 5.0e-5 mbar easily achieved
 
* Tool force of 30 kN  
 
* Tool force of 30 kN  
* Max chuck temp of 550°C
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* Max chuck temp of 500°C
 
* Substrate stack thicknesses of 500 um to 5 mm possible.  Thinner or thicker with tool engineer approval.
 
* Substrate stack thicknesses of 500 um to 5 mm possible.  Thinner or thicker with tool engineer approval.
  
 
==System overview==
 
==System overview==
 
===Hardware details===
 
===Hardware details===
* Up to 550 °C chuck temp
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* Up to 500 °C chuck temp
 
* 30 kN tool Pressure
 
* 30 kN tool Pressure
 
* 4" Chuck, 6" available by request
 
* 4" Chuck, 6" available by request
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===Material restrictions===
 
===Material restrictions===
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{{note|The approved materials listed for the {{PAGENAME}} are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the [[#supported processes]] section. For any other materials, please create a helpdesk ticket. }}
 
{{material restrictions}}
 
{{material restrictions}}
  
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<!-- Describe the checkout procedure for the tool. For example: -->
 
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# Read through this page and the Standard Operating Procedure above.
 
# Read through this page and the Standard Operating Procedure above.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training, and to review your process needs.
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] requesting checkout.
# A tool engineer will schedule a time for training and/or checkout.
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# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
 
 
==Maintenance==
 
*Anodic baseline run done monthly on 4" wafers
 
*chamber opened and cleaned Semi annually or as needed
 
*chucks cleaned every time they're changed or as needed
 
*clamp and spacer calibration checked bimonthly
 
*pressure uniformity tested as needed or when requested
 
===Process name===
 
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Latest revision as of 15:37, 5 August 2021

SB-6E Bonder
141031.jpg
Equipment Details
Technology Wafer bonding
Materials Restriction Semi-Clean
Material Processed silicon, glass
Sample Size 4" with 6" tooling available by request
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

This tool is used to bond 4" wafers, (and in some circumstances be configured for 6" wafers). It is primarily used for anodic bonding and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.


Capabilities

  • Chamber vacuum below 5.0e-5 mbar easily achieved
  • Tool force of 30 kN
  • Max chuck temp of 500°C
  • Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval.

System overview

Hardware details

  • Up to 500 °C chuck temp
  • 30 kN tool Pressure
  • 4" Chuck, 6" available by request
  • Chamber pressure below 5.0 e-5 mbar. Positive chamber pressure also available
  • N2 atmosphere possible in chamber

Substrate requirements

  • 4" round. 6" round by request
  • Si and glass wafers allowed
  • Wafer thickness between 500 µm and 5 mm with tool engineer discussion

Material restrictions

The approved materials listed for the SB-6E Bonder are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the #supported processes section. For any other materials, please create a helpdesk ticket.

The SB-6E Bonder is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

Anodic bonding of Si to glass is primarily supported on this tool. Other materials are allowed for other bonds also if requested. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.


Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training, and to review your process needs.
  3. Create a helpdesk ticket requesting checkout.
  4. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.