Difference between revisions of "SB-6E Bonder"
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Revision as of 15:09, 25 January 2016
| SB-6E Bonder | |
|---|---|
 | |
| Equipment Details | |
| Technology | Wafer bonding |
| Materials Restriction | Semi-Clean |
| Material Processed | silicon, glass |
| Sample Size | 4" with 6" tooling available by request |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
 Warning: | This page has not been released yet. |
This tool is used to bond 4" and 6" wafers. It is primarily used for anodic bonding and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.
Contents
Announcements
- None at this time
Capabilities
- Chamber vacuum below 5.0e-5 mbar easily achieved
- Tool force of 30 kN
- Max chuck temp of 550°C
- Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval.
System overview
Hardware details
- Up to 550 °C chuck temp
- 30 kN tool Pressure
- 4" Chuck, 6" available by request
- Chamber pressure below 5.0 e-5 mbar. Positive chamber pressure also available
- N2 atmosphere possible in chamber
Substrate requirements
- 4" round. 6" round by request
- Si and glass wafers allowed
- Wafer thickness between 500 µm and 5 mm with tool engineer discussion
Material restrictions
The SB-6E Bonder is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
Anodic bonding of Si to glass is primarily supported on this tool. Other materials are allowed for other bonds also if requested. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
Widget text will go here.
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for training and/or checkout.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
- Anodic baseline run done monthly on 4" wafers
- chamber opened and cleaned Semi annually or as needed
- chucks cleaned every time they're changed or as needed
- clamp and spacer calibration checked bimonthly
- pressure uniformity tested as needed or when requested
Process name
