SB-6E Bonder

SB-6E Bonder
Equipment Details
Technology	Wafer bonding
Materials Restriction	Semi-Clean
Material Processed	silicon, glass
Sample Size	4" with 6" tooling available by request
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes
Maintenance	Maintenance

Warning:

This page has not been released yet.

This tool is used to bond 4" and 6" wafers. It is primarily used for anodic bonding and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.

Announcements

• None at this time

Capabilities

• Chamber vacuum below 5.0e-5 mbar easily achieved
• Tool force of 30 kN
• Max chuck temp of 550°C
• Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval.

System overview

Hardware details

• Up to 550 °C chuck temp
• 30 kN tool Pressure
• 4" Chuck, 6" available by request
• Chamber pressure below 5.0 e-5 mbar. Positive chamber pressure also available
• N2 atmosphere possible in chamber

Substrate requirements

• 4" round. 6" round by request
• Si and glass wafers allowed
• Wafer thickness between 500 µm and 5 mm with tool engineer discussion

Material restrictions

The approved materials listed for the SB-6E Bonder are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the #supported processes section. For any other materials, please create a helpdesk ticket.

The SB-6E Bonder is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

Anodic bonding of Si to glass is primarily supported on this tool. Other materials are allowed for other bonds also if requested. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

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Checkout procedure

1. Read through this page and the Standard Operating Procedure above.
2. Practice with your mentor or another authorized user until you are comfortable with tool operation.
3. Create a Helpdesk Ticket requesting training.
4. A tool engineer will schedule a time for training and/or checkout.
5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Anodic baseline run done monthly on 4" wafers
• chamber opened and cleaned Semi annually or as needed
• chucks cleaned every time they're changed or as needed
• clamp and spacer calibration checked bimonthly
• pressure uniformity tested as needed or when requested