Difference between revisions of "SB-6E Bonder"

From LNF Wiki
Jump to navigation Jump to search
Line 28: Line 28:
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* Chamber vacuum below 5.0e-5mbar easily achieved
+
* Chamber vacuum below 5.0e-5 mbar easily achieved
* Tool force of 30kN
+
* Tool force of 30 kN
* Max chuck temp of 550 degrees C
+
* Max chuck temp of 550 °C
* Substrate stack thicknesses of 500um to 5mm possible.  Thinner or thicker with tool engineer approval.
+
* Substrate stack thicknesses of 500 um to 5 mm possible.  Thinner or thicker with tool engineer approval.
  
 
==System overview==
 
==System overview==

Revision as of 09:22, 25 August 2015

SB-6E Bonder
141031.jpg
Equipment Details
Technology substrate bonder
Materials Restriction Semi-Clean
Sample Size 4" with 6" tooling available by request
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

This tool is used to bond 4" and 6" wafers. It is primarily used for Anodic bonding and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.

Announcements

  • Update this with announcements as necessary

Capabilities

  • Chamber vacuum below 5.0e-5 mbar easily achieved
  • Tool force of 30 kN
  • Max chuck temp of 550 °C
  • Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval.

System overview

Hardware details

  • Up to 550 degrees C chuck temp
  • 30kN tool Pressure
  • 4" Chuck, 6" available by request
  • Chamber pressure below 5.0 e-5mbar. Positive chamber pressure also available
  • N2 atmosphere possible in chamber

Substrate requirements

  • 4" round. 6" round by request
  • Si and glass wafers allowed
  • Wafer thickness between 500um and 5mm with tool engineer discussion

Material restrictions

The SB-6E Bonder is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on SB-6E Bonder user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for training and/or checkout.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

needs maintenance done and stuff

Process name