Difference between revisions of "SB-6E Bonder"

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* Chamber vacuum below 5.0e-5 mbar easily achieved
 
* Chamber vacuum below 5.0e-5 mbar easily achieved
 
* Tool force of 30 kN  
 
* Tool force of 30 kN  
* Max chuck temp of 550 °C
+
* Max chuck temp of 550°C
 
* Substrate stack thicknesses of 500 um to 5 mm possible.  Thinner or thicker with tool engineer approval.
 
* Substrate stack thicknesses of 500 um to 5 mm possible.  Thinner or thicker with tool engineer approval.
  

Revision as of 14:48, 25 August 2015

SB-6E Bonder
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Equipment Details
Technology substrate bonder
Materials Restriction Semi-Clean
Material Processed silicon, glass
Sample Size 4" with 6" tooling available by request
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

This tool is used to bond 4" and 6" wafers. It is primarily used for Anodic bonding and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.

Announcements

  • Update this with announcements as necessary

Capabilities

  • Chamber vacuum below 5.0e-5 mbar easily achieved
  • Tool force of 30 kN
  • Max chuck temp of 550°C
  • Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval.

System overview

Hardware details

  • Up to 550 °C chuck temp
  • 30 kN tool Pressure
  • 4" Chuck, 6" available by request
  • Chamber pressure below 5.0 e-5 mbar. Positive chamber pressure also available
  • N2 atmosphere possible in chamber

Substrate requirements

  • 4" round. 6" round by request
  • Si and glass wafers allowed
  • Wafer thickness between 500 um and 5 mm with tool engineer discussion

Material restrictions

The SB-6E Bonder is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

Anodic bonding of Si to glass is primarily supported on this tool. Other materials are allowed for other bonds also if requested. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for training and/or checkout.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

  • Anodic baseline run done monthly on 4" wafers
  • chamber opened and cleaned Semi annually or as needed
  • chucks cleaned every time they're changed or as needed
  • clamp and spacer calibration checked bimonthly
  • pressure uniformity tested as needed or when requested

Process name