Difference between revisions of "SJ-26 Evaporator"

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All the e-beam evaporators in the LNF are setup using small point sources and long throw distances that lead to very directional deposition with minimal heat transfer.  This means that evaporated films have poor gap fill but make the tool ideal to use for [[Lift Off Paterning|lift off]] applications.  The evaporators in the LNF use thin films controllers with quartz crystal monitor feedback which pre-heat the source materials with the shutter closed and vary the e-beam power to maintain a preset deposition rate and to determine the total evaporation thickness.   
 
All the e-beam evaporators in the LNF are setup using small point sources and long throw distances that lead to very directional deposition with minimal heat transfer.  This means that evaporated films have poor gap fill but make the tool ideal to use for [[Lift Off Paterning|lift off]] applications.  The evaporators in the LNF use thin films controllers with quartz crystal monitor feedback which pre-heat the source materials with the shutter closed and vary the e-beam power to maintain a preset deposition rate and to determine the total evaporation thickness.   
 
==Announcements==
 
==Announcements==
*Update this with announcements as necessary
+
*This tool is currently offline, for a major system upgrade. Announcements as to the progression of the project will be discussed in the LNF Monthly Update. The targeted release date for this tool is January 2018.
  
 
==Capabilities==
 
==Capabilities==

Revision as of 11:57, 6 April 2017



SJ-26 Evaporator
62050.jpg
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Ag, Al2O3, Au, Fe, Ge, MgF, MgO, Pd, Px, SiO2, SiO, Ti, TiO2, ZnSe
Sample Size 4", 3" and 2" wafers, pieces
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance


The SJ-26 Evaporator is an electron beam evaporator used to deposit Ag, Al2O3, Au, Fe, Ge, MgF, MgO, Pd, Px, SiO2, SiO, Ti, TiO2, and ZnSe. It is large box coater with a multi-wafer dome or it can be run with a single wafer jig for thicker depositions.

All the e-beam evaporators in the LNF are setup using small point sources and long throw distances that lead to very directional deposition with minimal heat transfer. This means that evaporated films have poor gap fill but make the tool ideal to use for lift off applications. The evaporators in the LNF use thin films controllers with quartz crystal monitor feedback which pre-heat the source materials with the shutter closed and vary the e-beam power to maintain a preset deposition rate and to determine the total evaporation thickness.

Announcements

  • This tool is currently offline, for a major system upgrade. Announcements as to the progression of the project will be discussed in the LNF Monthly Update. The targeted release date for this tool is January 2018.

Capabilities

  • Multi-wafer lift-off evaporator
    • Medium-to-high deposition rate (2-10 Å/sec) metal, optical and dielectric films on a multi-wafer dome
    • Designed for low heat transfer and minimal sidewall coverage for liftoff applications
    • Stacks of multiple films can be run

System Overview

Hardware Details

  • Cryo-pumped box coater capable of low 10-5 Torr base pressure in 2 hrs of pumping
  • No reactive gasses or heating run on this tool
  • 4x15cc pocket E-beam gun to allow 4 different materials to be deposited in one run
  • Large distance from source and curved dome for liftoff applications


Substrate Requirements

  • 2”, 3” and 4” wafer holders available as well as clip fixtures for smaller pieces
  • Tool holds 6x4” or 14x3"fixtures.

Material Restrictions

The SJ-26 Evaporator is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

Fourteen films are available. If two thicknesses are listed the first is for the dome (6x4" wafers +8x3") and the second thickness is for the Jig (1x4" wafer or fixture)

Material Max thickness (Dome/Jig) Max Deposition Rate
Silver (Ag) 1 µm / NA 4 Å/sec
Alumina/Aluminum Oxide (Al2O3) 3000 Å / 2 µm 5 Å/sec
Gold (Au) 4000 Å / 2 µm 10 Å/sec
Iron (Fe) 2000 Å / NA 2 Å/sec
Germanium (Ge) 4000 Å / NA 10 Å/sec
Magnesium Fluoride (MgF) 1 µm / 3 µm 5 Å/sec
Magnesium Oxide (MgO) 1000 Å / NA 2 Å/sec
Palladium (Pd) 2000 Å / NA 6 Å/sec
Pyrex (Px) 1 µm / 3 µm 7 Å/sec
Silicon Dioxide (SiO2) 2000 Å / 1 µm 10 Å/sec
Silicon Monoxide (SiO) 2000 Å / 1 µm 10 Å/sec
Titanium (Ti) 1 µm / 3 µm 14 Å/sec
Titanium Dioxide (TiO2) 1000 Å / 3000 Å 3 Å/sec
Zinc Selenide (ZnSe) 1 µm / 3 µm 3 Å/sec


  • Some combinations of these films can be run. They are programmed 5 at a time in the automation software.

Each of the 14 films has a standard XTC film program outlined on the Standard Processes page. Combinations of films can be run in any order by programming them 3 at a time in the XTC controller.

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  • Read through this page and the Standard Operating Procedure above.
  • Create a Helpdesk Ticket requesting training.
  • A tool engineer will schedule a time for initial training.
  • Practice with your mentor or another authorized user until you are comfortable with tool operation.
  • Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

The SJ-26 is opened for scheduled maintenance:

  • Once a month and the gun area is cleaned and shutter is scraped.
  • The substrate mounting dome, sidewalls, shutters and covers are cleaned as needed (approximately once every 8-14 months.)
  • Tool leak checks, pumping speeds and film characterization are done periodically or when major tool changes are done.
  • Rough pump oil is changed once every 12 months. Cryo absorbers are replaced every 3 years.

Tool Pumping Performance

Pumping speeds and Leak-up rates vary based on chamber sidewall deposition and outside conditions such as humidity and time tool was open.

SJ-26 pumping speed - tool crosses over to hi-vac in 7.5-9minutes

Process Characterization

14 Films are standard in the SJ-26

Power Bump Recovery

The only maintenance that users are allowed to perform is power interruption recovery.

  • In the event of a power interruption, recovery of the tool within a few minutes will save the tool down time lost to a cryo regen.
  • Follow the power bump part of the SJ-26 Startup and Shutdown Procedure