SPR 220

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SPR 220 is our most commonly used photoresist, especially for RIE.

3µm - SPR 220 (3.0)

Process

1. Dehydrate and apply HMDS
2. Spin
3. Bake 115°C for 90sec
4. Wait 5 min
5. Expose

• • Stepper
    • Silicon - 0.40 sec
    • Aluminum (high reflection) - XXX
    • Low Reflection - 0.42 sec
  • Aligner - 7 sec

1. Wait 5 min
2. Bake 115°C for 90sec
3. Develop

• • ACS - AZ300 - 30sec
  • CEE - AZ726 30-30DP

Characterization

Stepper

Minimum Feature Size
Grating	700nm
Line	??
Trench	1µm
Hole	??
Pillar	??nm

Gratings with equal duty cycle.

Free standing trenches.

Contact Aligner

~2µm minimum feature size, but this is partially limited by the mask maker.

Equipment

• There are currently no equipment defined that use this chemical.

Technical Data Sheet

• Data Sheet

Safety Data Sheet

• There are currently no Safety Data Sheets (SDSes) for this chemical.