Difference between revisions of "SPR 955"

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#* [[GCA AS200 AutoStep]] - 0.3sec
 
#* [[MA-BA-6_Mask-Bond_Aligner|Contact Aligner]] - 5 sec
 
 
# Bake at 110°C for 90 sec
 
# Bake at 110°C for 90 sec
 
# Develop
 
# Develop

Revision as of 13:45, 2 May 2018


SPR 955 is an I-line series of photoresists developed by microchem, it's similar to SPR 220 but is formulated for thinner viscosities and higher resolution. We've been able to get 500nm gratings in 0.97µm of SPR 955 in the stepper, on silicon. This thickness was chosen because it's one of the peaks listed in the datasheets swing curve.

Processes

SPR 955 (0.97µm)

  1. Vapor prime wafer with HMDS
  2. Spin 0.97µm in ACS, CEE 200X #1 or CEE 100CB
  3. Bake at 100°C for 90 sec
  4. Verify thickness if possible, for thin resists small thickness variations drastically change the necessary exposure dose.
  5. Expose
Material Stepper Contact Aligner
Silicon 0.3 sec 5 sec
500nm SiO2 ? ?
  1. Bake at 110°C for 90 sec
  2. Develop

Notes: When photoresist is this thin the swing curve will have a larger effect; small thickness variations will have a larger change in the necessary exposure. Also at the end of the process you will have closer to .9-.94µm of resist.

These gratings are on silicon and exposed via the stepper. borderless borderless

Process Curves

SPR 955 0.97µm CD Loss vs Exposure.png

Technical Data Sheet

SPR 955 Datasheet

Safety Data Sheet

  • There are currently no Safety Data Sheets (SDSes) for this chemical.