SSEC Wafer and Mask Cleaner

SSEC Wafer and Mask Cleaner
SSEC Trilennium Wafer and Mask Cleaner
Equipment Details
Technology	Wafer cleaning
Materials Restriction	Metals
Mask Materials	5" and 7"
Sample Size	wafer size 4" and 6"
Chemicals Used	NH4OH, HF, H2SO4, H2O2
Gases Used	na
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes
Maintenance	Maintenance

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Capabilities

The SSEC Trilennium is a Photomask and single wafer cleaning system. This tool is used for post mechanical process cleaning of 100mm 150mm wafers, bonded small pieces as well as 7", 5", and 4" photolithography masks. The SSEC has four cleaning modules which include a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, a high-pressure scrub/rinse nozzle, and a multi-function dispense and etch nozzle. It is also equipped with a selection of mixing and spray dispensers. The SSES's four dispense arms offer access to different internal chemistry for sample cleans. Software supported recipes with chemical dilution, sample rinse and spin dry cycles allow for safe and repetable operation reducing hazard and exposure to processors.

The recipes available on the tool are

• Wafer (4" and 6" ) cleaning after Si and oxide CMP
• Piranha Mask cleaning
• It can process pieces when mounted on a wafer
• It can process pieces or samples of different heights

System overview

Hardware details

• 4", 6", wafer chuck and 5" mask chucks
• Chuck adapter for Laper mounting glass
• Rotary PVA brush arm
• Spray arm
• Megasonic arm
• HF arm
• top and bottom DI rinsing
• high rpm for sample drying
• Exchangeable chucks

Substrate requirements

• Wafer Size 4" and 6"
• Sample can be mounted on a wafer
• mounting wax cannot be exposed to the chemicals
• variable wafer height

• Chucks available:
• 

  4" wafer chuck

• 

  6" wafer chuck

• 

  5" mask chuck

• 

  7" mask chuck

Material restrictions

Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm. All materials that are not damaged by or react with the chemicals in the tool are accepted

Standard operating procedure

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Checkout procedure

In general the training/check out of this tool is done together with the CMP training/checkout

1. Make sure that you reserve the SSEC cleaner after the CMP.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for initial training.
4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.