Difference between revisions of "SSEC Wafer and Mask Cleaner"

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==Capabilities==
 
==Capabilities==
 
The SSEC Trilennium is a Photomask and single wafer cleaning system. This tool is used for post mechanical process cleaning of 100mm 150mm wafers, bonded small pieces, as well as 7", and  5" photolithography masks. The SSEC has four cleaning modules which include a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, a high-pressure scrub/rinse nozzle, and a multi-function dispense and etch nozzle. It is also equipped with a selection of mixing and spray dispensers. The SSES's four dispense arms offer access to different internal chemistry for sample cleans. Software supported recipes with chemical dilution, sample rinse and spin dry cycles allow for safe and repeatable operation reducing hazard and exposure to processors.
 
The SSEC Trilennium is a Photomask and single wafer cleaning system. This tool is used for post mechanical process cleaning of 100mm 150mm wafers, bonded small pieces, as well as 7", and  5" photolithography masks. The SSEC has four cleaning modules which include a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, a high-pressure scrub/rinse nozzle, and a multi-function dispense and etch nozzle. It is also equipped with a selection of mixing and spray dispensers. The SSES's four dispense arms offer access to different internal chemistry for sample cleans. Software supported recipes with chemical dilution, sample rinse and spin dry cycles allow for safe and repeatable operation reducing hazard and exposure to processors.
 
The recipes available on the tool are
 
 
* Wafer (4" and 6" ) cleaning after Si and oxide CMP
 
* Piranha Mask cleaning
 
* It can process pieces when mounted on a wafer
 
* It can process pieces or samples of different heights
 
  
 
==System overview==
 
==System overview==
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Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm.
 
Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm.
 
All materials that are not damaged by or react with the chemicals in the tool are accepted
 
All materials that are not damaged by or react with the chemicals in the tool are accepted
 +
 +
===Supported processes===
 +
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
 +
 +
<!-- In addition to these, this tool has a number of user-created recipes for cleaning a wide variety of materials. Some of these recipes are documented on SSEC Cleaner User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 +
-->
 +
* Wafer (4" and 6" ) cleaning after Si and oxide CMP
 +
* Piranha Mask cleaning
 +
* It can process pieces when mounted on a wafer
 +
* It can process pieces or samples of different heights
  
 
==Standard operating procedure==
 
==Standard operating procedure==
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==Checkout procedure==
 
==Checkout procedure==
In general the training/check out of this tool is done together with the CMP training/checkout
+
In general, the training/check out of this tool is done together with the CMP training/checkout
 
# Make sure that you reserve the SSEC cleaner after the CMP.
 
# Make sure that you reserve the SSEC cleaner after the CMP.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.

Revision as of 15:23, 9 April 2018

SSEC Wafer and Mask Cleaner
180011.jpg
SSEC Trilennium Wafer and Mask Cleaner
Equipment Details
Technology Wafer cleaning
Materials Restriction Metals
Mask Materials 5" and 7"
Sample Size wafer size 4" and 6"
Chemicals Used NH4OH, HF, H2SO4, H2O2
Gases Used na
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


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Announcements

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Capabilities

The SSEC Trilennium is a Photomask and single wafer cleaning system. This tool is used for post mechanical process cleaning of 100mm 150mm wafers, bonded small pieces, as well as 7", and 5" photolithography masks. The SSEC has four cleaning modules which include a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, a high-pressure scrub/rinse nozzle, and a multi-function dispense and etch nozzle. It is also equipped with a selection of mixing and spray dispensers. The SSES's four dispense arms offer access to different internal chemistry for sample cleans. Software supported recipes with chemical dilution, sample rinse and spin dry cycles allow for safe and repeatable operation reducing hazard and exposure to processors.

System overview

Hardware details

  • 4", 6", wafer chuck and 5" mask chucks
  • Chuck adapter for Laper mounting glass
  • Rotary PVA brush arm
  • Spray arm
  • Megasonic arm
  • HF arm
  • top and bottom DI rinsing
  • high rpm for sample drying
  • Exchangeable chucks

Substrate requirements

  • Wafer Size 4" and 6"
  • Sample can be mounted on a wafer
  • mounting wax cannot be exposed to the chemicals
  • variable wafer height

Material restrictions

Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm. All materials that are not damaged by or react with the chemicals in the tool are accepted

Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

  • Wafer (4" and 6" ) cleaning after Si and oxide CMP
  • Piranha Mask cleaning
  • It can process pieces when mounted on a wafer
  • It can process pieces or samples of different heights

Standard operating procedure

Widget text will go here.

Checkout procedure

In general, the training/check out of this tool is done together with the CMP training/checkout

  1. Make sure that you reserve the SSEC cleaner after the CMP.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Process name

File:Pilars pic.jpg