Difference between revisions of "SSEC Wafer and Mask Cleaner"

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Set the Process Technology (Wafer Cleaning)  
 
Set the Process Technology (Wafer Cleaning)  
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--> {{#vardefine:technology|Wafer cleaning}} <!--
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
--> {{#vardefine:restriction|3}}
 
--> {{#vardefine:restriction|3}}
 
{{infobox equipment
 
{{infobox equipment
 
|caption = SSEC Trilennium Wafer and Mask Cleaner
 
|caption = SSEC Trilennium Wafer and Mask Cleaner
|materials = no restrictions
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|materials =  
 
|mask = 5" and 7"  
 
|mask = 5" and 7"  
|size = wafer size 4" and 6"
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|size = wafer size 6", 4" and mounted pieces.
 
|chemicals =NH<sub>4</sub>OH, HF, H<sub>2</sub>SO<sub>4</sub>, H<sub>2</sub>O<sub>2</sub>
 
|chemicals =NH<sub>4</sub>OH, HF, H<sub>2</sub>SO<sub>4</sub>, H<sub>2</sub>O<sub>2</sub>
 
|gases = na
 
|gases = na
 
|overview = [https://docs.google.com/document/d/11t8N4LPEQWqJO70L6xWE7EG6RiRYopD7_Q8p10ZGRsA/preview System Overview]
 
|overview = [https://docs.google.com/document/d/11t8N4LPEQWqJO70L6xWE7EG6RiRYopD7_Q8p10ZGRsA/preview System Overview]
|sop = [https://link.to.google.doc/preview SOP]
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|sop = [https://docs.google.com/document/d/1DFrqq_0csijzsBPrTbcaNF7pCTEgiBVYpH14S369Ay0/preview SOP]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
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<!--|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]] -->
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
}}
 
}}
  
{{warning|This page has not been released yet.}}
 
  
 
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==Announcements==
 
==Announcements==
*Update this with announcements as necessary
 
  
 
==Capabilities==
 
==Capabilities==
The SSEC Trilenium is a single wafer cleaner. This tool is mostly used for "after CMP cleaning" of 4", 6" wafers as well as pieces. It also has the capability for mask cleaning.  This tool includes a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, high pressure scrub/rinse nozzle, a multi-function etch nozzle, and a selection of mixing and spray dispensers. The chamber is fitted with these four dispense arms, each of with access to different chemistry. Internal chemistry dilution allows operation from concentrate supplies, reducing operator hazard and exposure.
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The SSEC Trilennium is a Photomask and single wafer cleaning system. This tool is used for post mechanical process cleaning of 100mm 150mm wafers, bonded small pieces, as well as 7", and  5" photolithography masks. The SSEC has four cleaning modules which include a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, a high-pressure scrub/rinse nozzle, and a multi-function dispense and etch nozzle. It is also equipped with a selection of mixing and spray dispensers. The SSES's four dispense arms offer access to different internal chemistry for sample cleans. Software supported recipes with chemical dilution, sample rinse and spin dry cycles allow for safe and repeatable operation reducing hazard and exposure to processors.
 
 
The recipes available on the tool are
 
 
* Wafer (4" and 6" ) cleaning after Si and oxide CMP
 
* Piranha Mask cleaning
 
* It can process pieces when mounted on a wafer
 
* It can process pieces or samples of different heights
 
  
 
==System overview==
 
==System overview==
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* mounting wax cannot be exposed to the chemicals
 
* mounting wax cannot be exposed to the chemicals
 
* variable wafer height
 
* variable wafer height
Chucks available
 
  
[[File:File.jpg|300px|Wafer Chuck]]  [[File:Ssec mask chuck.jpg|300px|Mask Chuck]]
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<gallery caption="Chucks available:" mode=packed heights=200px>
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File:SSEC 4 inch wafer chuck.JPG|4" wafer chuck
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File:SSEC 6 inch wafer chuck.JPG|6" wafer chuck
 +
File:SSEC 5 inch mask chuck.JPG|5" mask chuck
 +
File:7 inch mask chuck.JPG|7" mask chuck
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</gallery>
  
 
===Material restrictions===
 
===Material restrictions===
 
Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm.
 
Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm.
 
All materials that are not damaged by or react with the chemicals in the tool are accepted
 
All materials that are not damaged by or react with the chemicals in the tool are accepted
 +
 +
===Supported processes===
 +
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
 +
 +
<!-- In addition to these, this tool has a number of user-created recipes for cleaning a wide variety of materials. Some of these recipes are documented on SSEC Cleaner User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 +
-->
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* Wafer (4" and 6" ) cleaning after Si and oxide CMP
 +
* Piranha Mask cleaning
 +
* Pieces Processing is available when mounted on a wafer
  
 
==Standard operating procedure==
 
==Standard operating procedure==
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=googledocid}}
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{{#widget:GoogleDoc|key=1DFrqq_0csijzsBPrTbcaNF7pCTEgiBVYpH14S369Ay0}}
  
 
==Checkout procedure==
 
==Checkout procedure==
In general the training/check out of this tool is done together with the CMP training/checkout
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Training and check out of the SSEC is done typically completed together when processing on the CMP
# Make sure that you reserve the SSEC cleaner after the CMP.
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# Read through the Standard Operating Procedure.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# A tool engineer will schedule a time for initial training.
 
# A tool engineer will schedule a time for initial training.
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|border=0
 
|border=0
 
}}
 
}}
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[[File:Pilars pic.jpg]]

Latest revision as of 16:27, 18 October 2021

SSEC Wafer and Mask Cleaner
180011.jpg
SSEC Trilennium Wafer and Mask Cleaner
Equipment Details
Technology Wafer cleaning
Materials Restriction Metals
Mask Materials 5" and 7"
Sample Size wafer size 6", 4" and mounted pieces.
Chemicals Used NH4OH, HF, H2SO4, H2O2
Gases Used na
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance



The SSEC Wafer and Mask Cleaner is a...

Announcements

Capabilities

The SSEC Trilennium is a Photomask and single wafer cleaning system. This tool is used for post mechanical process cleaning of 100mm 150mm wafers, bonded small pieces, as well as 7", and 5" photolithography masks. The SSEC has four cleaning modules which include a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, a high-pressure scrub/rinse nozzle, and a multi-function dispense and etch nozzle. It is also equipped with a selection of mixing and spray dispensers. The SSES's four dispense arms offer access to different internal chemistry for sample cleans. Software supported recipes with chemical dilution, sample rinse and spin dry cycles allow for safe and repeatable operation reducing hazard and exposure to processors.

System overview

Hardware details

  • 4", 6", wafer chuck and 5" mask chucks
  • Chuck adapter for Laper mounting glass
  • Rotary PVA brush arm
  • Spray arm
  • Megasonic arm
  • HF arm
  • top and bottom DI rinsing
  • high rpm for sample drying
  • Exchangeable chucks

Substrate requirements

  • Wafer Size 4" and 6"
  • Sample can be mounted on a wafer
  • mounting wax cannot be exposed to the chemicals
  • variable wafer height

Material restrictions

Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm. All materials that are not damaged by or react with the chemicals in the tool are accepted

Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

  • Wafer (4" and 6" ) cleaning after Si and oxide CMP
  • Piranha Mask cleaning
  • Pieces Processing is available when mounted on a wafer

Standard operating procedure

Widget text will go here.

Checkout procedure

Training and check out of the SSEC is done typically completed together when processing on the CMP

  1. Read through the Standard Operating Procedure.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Process name

File:Pilars pic.jpg