Difference between revisions of "SSEC Wafer and Mask Cleaner"
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--> {{#vardefine:toolid|180011}} <!-- | --> {{#vardefine:toolid|180011}} <!-- | ||
Set the Process Technology (Wafer Cleaning) | Set the Process Technology (Wafer Cleaning) | ||
| − | --> {{#vardefine:technology|Wafer | + | --> {{#vardefine:technology|Wafer cleaning}} <!-- |
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals | Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals | ||
--> {{#vardefine:restriction|3}} | --> {{#vardefine:restriction|3}} | ||
{{infobox equipment | {{infobox equipment | ||
|caption = SSEC Trilennium Wafer and Mask Cleaner | |caption = SSEC Trilennium Wafer and Mask Cleaner | ||
| − | |materials = | + | |materials = |
|mask = 5" and 7" | |mask = 5" and 7" | ||
| − | |size = wafer size 4" and | + | |size = wafer size 6", 4" and mounted pieces. |
|chemicals =NH<sub>4</sub>OH, HF, H<sub>2</sub>SO<sub>4</sub>, H<sub>2</sub>O<sub>2</sub> | |chemicals =NH<sub>4</sub>OH, HF, H<sub>2</sub>SO<sub>4</sub>, H<sub>2</sub>O<sub>2</sub> | ||
|gases = na | |gases = na | ||
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|sop = [https://docs.google.com/document/d/1DFrqq_0csijzsBPrTbcaNF7pCTEgiBVYpH14S369Ay0/preview SOP] | |sop = [https://docs.google.com/document/d/1DFrqq_0csijzsBPrTbcaNF7pCTEgiBVYpH14S369Ay0/preview SOP] | ||
|processes = [[{{PAGENAME}}/Processes|Supported Processes]] | |processes = [[{{PAGENAME}}/Processes|Supported Processes]] | ||
| − | |userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]] | + | <!--|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]] --> |
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]] | |maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]] | ||
}} | }} | ||
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<!-- Insert the tool description here --> | <!-- Insert the tool description here --> | ||
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==Announcements== | ==Announcements== | ||
| − | |||
==Capabilities== | ==Capabilities== | ||
| − | The SSEC | + | The SSEC Trilennium is a Photomask and single wafer cleaning system. This tool is used for post mechanical process cleaning of 100mm 150mm wafers, bonded small pieces, as well as 7", and 5" photolithography masks. The SSEC has four cleaning modules which include a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, a high-pressure scrub/rinse nozzle, and a multi-function dispense and etch nozzle. It is also equipped with a selection of mixing and spray dispensers. The SSES's four dispense arms offer access to different internal chemistry for sample cleans. Software supported recipes with chemical dilution, sample rinse and spin dry cycles allow for safe and repeatable operation reducing hazard and exposure to processors. |
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| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
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==System overview== | ==System overview== | ||
| Line 54: | Line 45: | ||
* mounting wax cannot be exposed to the chemicals | * mounting wax cannot be exposed to the chemicals | ||
* variable wafer height | * variable wafer height | ||
| − | |||
| − | + | <gallery caption="Chucks available:" mode=packed heights=200px> | |
| + | File:SSEC 4 inch wafer chuck.JPG|4" wafer chuck | ||
| + | File:SSEC 6 inch wafer chuck.JPG|6" wafer chuck | ||
| + | File:SSEC 5 inch mask chuck.JPG|5" mask chuck | ||
| + | File:7 inch mask chuck.JPG|7" mask chuck | ||
| + | </gallery> | ||
===Material restrictions=== | ===Material restrictions=== | ||
Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm. | Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm. | ||
All materials that are not damaged by or react with the chemicals in the tool are accepted | All materials that are not damaged by or react with the chemicals in the tool are accepted | ||
| + | |||
| + | ===Supported processes=== | ||
| + | There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page. | ||
| + | |||
| + | <!-- In addition to these, this tool has a number of user-created recipes for cleaning a wide variety of materials. Some of these recipes are documented on SSEC Cleaner User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system. | ||
| + | --> | ||
| + | * Wafer (4" and 6" ) cleaning after Si and oxide CMP | ||
| + | * Piranha Mask cleaning | ||
| + | * Pieces Processing is available when mounted on a wafer | ||
==Standard operating procedure== | ==Standard operating procedure== | ||
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==Checkout procedure== | ==Checkout procedure== | ||
| − | + | Training and check out of the SSEC is done typically completed together when processing on the CMP | |
| − | # | + | # Read through the Standard Operating Procedure. |
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training. | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training. | ||
# A tool engineer will schedule a time for initial training. | # A tool engineer will schedule a time for initial training. | ||
| Line 85: | Line 89: | ||
|border=0 | |border=0 | ||
}} | }} | ||
| + | |||
| + | [[File:Pilars pic.jpg]] | ||
Latest revision as of 17:27, 18 October 2021
| SSEC Wafer and Mask Cleaner | |
|---|---|
 SSEC Trilennium Wafer and Mask Cleaner | |
| Equipment Details | |
| Technology | Wafer cleaning |
| Materials Restriction | Metals |
| Mask Materials | 5" and 7" |
| Sample Size | wafer size 6", 4" and mounted pieces. |
| Chemicals Used | NH4OH, HF, H2SO4, H2O2 |
| Gases Used | na |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| Maintenance | Maintenance |
The SSEC Wafer and Mask Cleaner is a...
Contents
Announcements
Capabilities
The SSEC Trilennium is a Photomask and single wafer cleaning system. This tool is used for post mechanical process cleaning of 100mm 150mm wafers, bonded small pieces, as well as 7", and 5" photolithography masks. The SSEC has four cleaning modules which include a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, a high-pressure scrub/rinse nozzle, and a multi-function dispense and etch nozzle. It is also equipped with a selection of mixing and spray dispensers. The SSES's four dispense arms offer access to different internal chemistry for sample cleans. Software supported recipes with chemical dilution, sample rinse and spin dry cycles allow for safe and repeatable operation reducing hazard and exposure to processors.
System overview
Hardware details
- 4", 6", wafer chuck and 5" mask chucks
- Chuck adapter for Laper mounting glass
- Rotary PVA brush arm
- Spray arm
- Megasonic arm
- HF arm
- top and bottom DI rinsing
- high rpm for sample drying
- Exchangeable chucks
Substrate requirements
- Wafer Size 4" and 6"
- Sample can be mounted on a wafer
- mounting wax cannot be exposed to the chemicals
- variable wafer height
- Chucks available:
4" wafer chuck
6" wafer chuck
5" mask chuck
7" mask chuck
Material restrictions
Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm. All materials that are not damaged by or react with the chemicals in the tool are accepted
Supported processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
- Wafer (4" and 6" ) cleaning after Si and oxide CMP
- Piranha Mask cleaning
- Pieces Processing is available when mounted on a wafer
Standard operating procedure
Widget text will go here.
Checkout procedure
Training and check out of the SSEC is done typically completed together when processing on the CMP
- Read through the Standard Operating Procedure.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
Process name
