Difference between revisions of "SSEC Wafer and Mask Cleaner"

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* variable wafer height
* variable wafer height
Chucks available
Chucks available
•[[File:File.jpg]] to use the full version of the file
•[[File:File.jpg|200px]] to use the full version of the file
===Material restrictions===
===Material restrictions===

Revision as of 16:42, 24 September 2015

SSEC Wafer and Mask Cleaner
SSEC Trilennium Wafer and Mask Cleaner
Equipment Details
Technology Wafer Cleaning
Materials Restriction Metals
Material Processed no restrictions
Mask Materials 5" and 7"
Sample Size wafer size 4" and 6"
Chemicals Used NH4OH, HF, H2SO4, H2O2
Gases Used na
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance

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The SSEC Wafer and Mask Cleaner is a...


  • Update this with announcements as necessary


The SSEC Trilenium is a single wafer cleaner. This tool is mostly used for "after CMP cleaning" of 4", 6" wafers as well as pieces. It also has the capability for mask cleaning. This tool includes a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, high pressure scrub/rinse nozzle, a multi-function etch nozzle, and a selection of mixing and spray dispensers. The chamber is fitted with these four dispense arms, each of with access to different chemistry. Internal chemistry dilution allows operation from concentrate supplies, reducing operator hazard and exposure.

The recipes available on the tool are

  • Wafer (4" and 6" ) cleaning after Si and oxide CMP
  • Piranha Mask cleaning
  • It can process pieces when mounted on a wafer
  • It can process pieces or samples of different heights

System overview

Hardware details

  • 4", 6", wafer chuck and 5" mask chucks
  • Chuck adapter for Laper mounting glass
  • Rotary PVA brush arm
  • Spray arm
  • Megasonic arm
  • HF arm
  • top and bottom DI rinsing
  • high rpm for sample drying
  • Exchangeable chucks

Substrate requirements

  • Wafer Size 4" and 6"
  • Sample can be mounted on a wafer
  • mounting wax cannot be exposed to the chemicals
  • variable wafer height

Chucks available •File.jpg to use the full version of the file

Material restrictions

Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm. All materials that are not damaged by or react with the chemicals in the tool are accepted

Standard operating procedure

Widget text will go here.

Checkout procedure

In general the training/check out of this tool is done together with the CMP training/checkout

  1. Make sure that you reserve the SSEC cleaner after the CMP.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.


Process name