Difference between revisions of "SSEC Wafer and Mask Cleaner"
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==Standard operating procedure== | ==Standard operating procedure== | ||
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==Checkout procedure== | ==Checkout procedure== | ||
Revision as of 15:09, 25 September 2015
| SSEC Wafer and Mask Cleaner | |
|---|---|
 SSEC Trilennium Wafer and Mask Cleaner | |
| Equipment Details | |
| Technology | Wafer Cleaning |
| Materials Restriction | Metals |
| Material Processed | no restrictions |
| Mask Materials | 5" and 7" |
| Sample Size | wafer size 4" and 6" |
| Chemicals Used | NH4OH, HF, H2SO4, H2O2 |
| Gases Used | na |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
 Warning: | This page has not been released yet. |
The SSEC Wafer and Mask Cleaner is a...
Contents
Announcements
- Update this with announcements as necessary
Capabilities
The SSEC Trilenium is a single wafer cleaner. This tool is mostly used for "after CMP cleaning" of 4", 6" wafers as well as pieces. It also has the capability for mask cleaning. This tool includes a single-brush scrub, 1.5 MHz quartz-enclosed megasonic transducer, high pressure scrub/rinse nozzle, a multi-function etch nozzle, and a selection of mixing and spray dispensers. The chamber is fitted with these four dispense arms, each of with access to different chemistry. Internal chemistry dilution allows operation from concentrate supplies, reducing operator hazard and exposure.
The recipes available on the tool are
- Wafer (4" and 6" ) cleaning after Si and oxide CMP
- Piranha Mask cleaning
- It can process pieces when mounted on a wafer
- It can process pieces or samples of different heights
System overview
Hardware details
- 4", 6", wafer chuck and 5" mask chucks
- Chuck adapter for Laper mounting glass
- Rotary PVA brush arm
- Spray arm
- Megasonic arm
- HF arm
- top and bottom DI rinsing
- high rpm for sample drying
- Exchangeable chucks
Substrate requirements
- Wafer Size 4" and 6"
- Sample can be mounted on a wafer
- mounting wax cannot be exposed to the chemicals
- variable wafer height
Chucks available
Material restrictions
Wafers with exposed mounting materials that can react with the chemicals in the tool are not allowed. There is direct contact between the PVA brush and the surface, cleaning is done by scrubbing, therefore delicate structures should not be exposed to the brush or the megasonic arm. All materials that are not damaged by or react with the chemicals in the tool are accepted
Standard operating procedure
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Checkout procedure
In general the training/check out of this tool is done together with the CMP training/checkout
- Make sure that you reserve the SSEC cleaner after the CMP.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
Process name
