Difference between revisions of "STS APS DGRIE/Processes/LNF Polymer"
< STS APS DGRIE | Processes
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{{Infobox process | {{Infobox process | ||
|technology = RIE | |technology = RIE | ||
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|modified = | |modified = | ||
|authors = Shawn Wright & Kevin Owen | |authors = Shawn Wright & Kevin Owen | ||
| − | }} | + | }} [[Category:Processes]] [[Category:RIE]] |
| − | [[Category:Processes]] | ||
| − | [[Category:RIE]] | ||
| − | + | [[{{PAGENAME}}|{{SUBPAGENAME}}]] is an O<sub>2</sub> based plasma etch for thin film polymers (e.g. [[polyimide]], [[parylene]]). | |
| − | + | ==Procedure== | |
| − | == | + | Follow the instructions in the tool [[{{ROOTPAGENAME}}#Standard operating procedure|operating procedure]] and select ''LNF Polymer'' from the supported processes folder. |
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==Parameters== | ==Parameters== | ||
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|5 mTorr | |5 mTorr | ||
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| − | | | + | |ICP Power |
|2000 W | |2000 W | ||
|- | |- | ||
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|He Flow | |He Flow | ||
|100 sccm | |100 sccm | ||
| − | |- | + | |} |
| + | |||
| + | ==Characterization== | ||
| + | <!-- Use this section to put any characterization data. Examples in headings below. Can go in separate sections or a bulleted list.--> | ||
| + | |||
| + | ===Etch Rate=== | ||
| + | *Polyimide: 920 nm/min | ||
| + | *Parylene: 1.3 µm/min (user reported) | ||
| + | |||
| + | ===Uniformity=== | ||
| + | Not tested. | ||
| + | |||
| + | ===Mask selectivity=== | ||
| + | *Platinum: ~1.5 nm/min | ||
| + | *SiO<sub>2</sub>: 28 nm/min | ||
| + | *Aluminum: < 2 nm/min (varies with etch time; e.g. 30 sec or less is higher, ~4 nm/min) (user reported) | ||
| + | |||
| + | ==Limitations== | ||
| + | Oxygen plasmas are predominantly isotropic; the specific isotropy ratio has not been measured for this process. Standard photoresist masks are not recommended, since they are polymers and will also etch quickly with this process. However, there are limitations to what type of hard mask is acceptable, so please create a helpdesk ticket to discuss your process with a tool engineer. | ||
| + | |||
| + | ==Qualification== | ||
| + | None at this time. | ||
Latest revision as of 15:51, 30 March 2022
| About this Process | |
|---|---|
| Process Details | |
| Equipment | STS APS DGRIE |
| Technology | RIE |
| Material | Polyimide |
| Mask Materials | Photoresist, SiO2, Aluminum |
| Gases Used | O2, He |
| Date Created | October 2020 |
| Authored By | Shawn Wright & Kevin Owen |
LNF Polymer is an O2 based plasma etch for thin film polymers (e.g. polyimide, parylene).
Contents
Procedure
Follow the instructions in the tool operating procedure and select LNF Polymer from the supported processes folder.
Parameters
| Parameter | Main Etch |
|---|---|
| Pressure | 5 mTorr |
| ICP Power | 2000 W |
| Bias Power | 30 W |
| O2 Flow | 90 sccm |
| He Flow | 100 sccm |
Characterization
Etch Rate
- Polyimide: 920 nm/min
- Parylene: 1.3 µm/min (user reported)
Uniformity
Not tested.
Mask selectivity
- Platinum: ~1.5 nm/min
- SiO2: 28 nm/min
- Aluminum: < 2 nm/min (varies with etch time; e.g. 30 sec or less is higher, ~4 nm/min) (user reported)
Limitations
Oxygen plasmas are predominantly isotropic; the specific isotropy ratio has not been measured for this process. Standard photoresist masks are not recommended, since they are polymers and will also etch quickly with this process. However, there are limitations to what type of hard mask is acceptable, so please create a helpdesk ticket to discuss your process with a tool engineer.
Qualification
None at this time.
