Difference between revisions of "STS Pegasus 4"

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==Standard Operating Procedure==
 
==Standard Operating Procedure==
 
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==Checkout Procedure==
 
==Checkout Procedure==

Revision as of 09:36, 21 April 2015


STS Pegasus 4
14021.jpg
Equipment Details
Technology DRIE
Materials Restriction Semi-Clean
Material Processed Si
Mask Materials PR, SiO2
Sample Size 4 inch (100 mm)
Gases Used Ar, C4F8, O2, SF6
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes


Warning Warning: This page has not been released yet.

The SPTS Pegasus 4 is a DRIE tool used to etch 4" silicon wafers.

Announcements

  • [2015-01-9] - Added toolwide 15% increase in bias

Capabilities

  • High etch rates ~15 µm /min
  • Nearly vertical sidewalls ~89°
  • High selectivity to photoresist and SiO2

System Overview

Hardware Details

  • Gases
    • High Precision Fast Acting Chamber Mounted MFC's
      • C4F8 - 400 sccm
      • SF6 - 1200 sccm
      • O2 - 200 sccm
    • Standard Gasbox Mounted MFC
      • Ar - 283 sccm
  • Pressure
    • 1550 L/sec Mag 2000 CTS Turbo Pump
    • 2-250 mTorr
    • Fast acting VAT pendulum valve
      • Allows fast switching of BOSCH recipes (~1.5 seconds minimum)
  • Chuck
    • 100 mm Wafer
    • 0-20 Torr Backside He Cooling
    • -20°C to 20°C
  • Chamber
    • 120°C Walls
    • Aluminum Walls
  • RF
    • 5 kW 13.56 Mhz Coil
    • 300 W 13.56 Mhz Platen
    • 500 W 380 kHz Platen with Pulsed Power Supply
    • 10A Chamber Outer Electromagnet
    • 30A Chamber Outer Electromagnet

Substrate Requirements

  • 100 mm (4") wafers
  • If the etch will leave less than 100µm remaining, a carrier wafer must be used
  • Sample/carrier must be conductive, or a semiconductor for wafer to clamp on electrostatic chuck
    • Pyrex glass with an Si layer on top has worked

Material Restrictions

The STS Pegasus 4 is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on STS Pegasus 4 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

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https://docs.google.com/spreadsheets/d/1y2OAkjEreo2KURTV9gacNRfOHmbdh3kAHlMbl2gVpAI/pubhtml?gid=551848064&single=true

Checkout Procedure

  1. Read through the Standard Operating Procedure above.
  2. Complete the training request form [<link> here].
  3. Create a helpdesk ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz [<link> here].
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Tool Qualification

LNF Recipe 1, 2, 3

To verify the condition of the tool an etch is performed on recipe 1, 2 and 3, rotating each week. The etch rate is measured on a 100 um wide trench in 5 locations. The average of this is shown below.