Silicon
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| Silicon | |
|---|---|
| Material Details | |
| Material Restriction | Undefined |
A description & relevant information for this material need to be added.
Contents
Applications
Discuss common uses/applications for this material.
Processing Tools
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Equipment
- Etching
- Deposition
Poly silicon
Tempress S1T3 - N-type in Situ Doped Poly-Si 6"
The Tempress S1T3 furnace tube is a CMOS clean, modular, horizontal furnace tube that uses the LPCVD process to deposit n-type doped poly-silicon.
Tempress S3T3 - Flat Poly-Si 4"
The Tempress S3T3 furnace tube is a CMOS clean, modular, horizontal furnace tube that uses the LPCVD process to deposit poly-silicon, annealed poly-silicon and amorphous silicon.
Tempress S6T3 - Flat Poly-Si 4"
The Tempress S6T3 furnace tube is a metals allowed, modular, horizontal furnace tube that uses the LPCVD process to deposit poly-silicon, annealed poly-silicon, and amorphous silicon.
Doped Poly silicon
Tempress S3T4 - N-type in Situ Doped Poly-Si 4"
The Tempress S3T4 furnace tube is a CMOS clean, modular, horizontal furnace tube that uses the LPCVD process to deposit n-type doped poly-silicon.
Tempress S4T3 - P-type in Situ Doped Poly-Si 4"
The Tempress S4T3 furnace tube is a CMOS clean, modular, horizontal furnace tube that uses the LPCVD process to deposit p-type doped poly-silicon.
Processes
- List of chemical (or otherwise) processes for this material
