Difference between revisions of "Silicon dioxide"

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**[[Atomic_layer_deposition|Atomic Layer Deposition (ALD)]]
 
**[[Atomic_layer_deposition|Atomic Layer Deposition (ALD)]]
 
**[[Low_pressure_chemical_vapor_deposition|Low-Pressure Chemical Vapor Deposition (LPCVD)]]
 
**[[Low_pressure_chemical_vapor_deposition|Low-Pressure Chemical Vapor Deposition (LPCVD)]]
**[[Parylene_deposition|Parylene deposition]]
 
 
**[[PECVD|Plasma Enhanced Chemical Vapor Deposition (PECVD)]]
 
**[[PECVD|Plasma Enhanced Chemical Vapor Deposition (PECVD)]]
  

Revision as of 08:14, 10 July 2019

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Description

A description & relevant information for this material need to be added.

Processing Tools

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Equipment

Processes

Deposition Processes

  • List of chemical (or otherwise) processes for this material

Etch Processes

  • List of chemical (or otherwise) processes for this material

Applications

Discuss common uses/applications for this material.

References

Internal References: {Incoming} External References:

  • Citations/references for this material