Difference between revisions of "Silicon dioxide"
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===Processes=== | ===Processes=== | ||
+ | * [[Chemical vapor deposition|Chemical Vapor Deposition (CVD)]] | ||
+ | **[[Atomic_layer_deposition|Atomic Layer Deposition (ALD)]] | ||
+ | **[[Low_pressure_chemical_vapor_deposition|Low-Pressure Chemical Vapor Deposition (LPCVD)]] | ||
+ | **[[Parylene_deposition|Parylene deposition]] | ||
+ | **[[PECVD|Plasma Enhanced Chemical Vapor Deposition (PECVD)]] | ||
+ | |||
+ | * [[Physical vapor deposition]] (PVD) | ||
+ | **[[Electron_beam_evaporation|E-beam evaporation]] | ||
+ | **[[Sputter_deposition|Sputter deposition] | ||
====Deposition Processes==== | ====Deposition Processes==== |
Revision as of 09:10, 10 July 2019
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Description
A description & relevant information for this material need to be added.
Processing Tools
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.