Difference between revisions of "Silicon dioxide"
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**[[Atomic_layer_deposition|Atomic Layer Deposition (ALD)]] | **[[Atomic_layer_deposition|Atomic Layer Deposition (ALD)]] | ||
**[[Low_pressure_chemical_vapor_deposition|Low-Pressure Chemical Vapor Deposition (LPCVD)]] | **[[Low_pressure_chemical_vapor_deposition|Low-Pressure Chemical Vapor Deposition (LPCVD)]] | ||
| − | |||
**[[PECVD|Plasma Enhanced Chemical Vapor Deposition (PECVD)]] | **[[PECVD|Plasma Enhanced Chemical Vapor Deposition (PECVD)]] | ||
Revision as of 09:14, 10 July 2019
 Warning: | This page has not been released yet. |
Contents
Description
A description & relevant information for this material need to be added.
Processing Tools
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Equipment
Processes
Deposition Processes
- List of chemical (or otherwise) processes for this material
Etch Processes
- List of chemical (or otherwise) processes for this material
Applications
Discuss common uses/applications for this material.
References
Internal References: {Incoming} External References:
- Citations/references for this material
