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Sputter deposition

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{{infobox technology
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|technology = PVD
[[{{PAGENAME}}]] is a [[physical vapor deposition]] method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically [[argon]]). The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
==Further reading==
*[[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition]]
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