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Plasmatherm 790

51 bytes added, 7 years ago
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* Wide variety of gases available
* Generally slower etch rates <1000 Å/min
* Generally slow PECVD deposition rates <10 Å/sec
==System Overview==
====Right Chamber====
The right chamber has the same restrictions as the left except polymers (such as photoresist) are not allowed unless their melting temperature is significantly higher then than the process temperature (please create a helpdesk ticket for this).
==Supported Processes==
Administrator, LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser