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Plasmatherm 790

219 bytes removed, 11 months ago
The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for [[Reactive ion etching|reactive ion etching (RIE)]] while the right chamber is configured for [[PECVD|plasma enhanced chemical vapor deposition (PECVD)]]. The RIE chamber is significantly slower than other etchers available in the lab, allowing greater depth control on thin films. The PECVD chamber is also designed to deposit at a lower rate than the [[GSI PECVD]] and [[P5000 PECVD]] - the smaller building blocks help improve film quality. This tool has almost no material restrictions, allowing a wide variety of processing.
*[2014-09-25] - Added 500 sccm Helium MFC to PECVD chamber.
* Pressure
** RIE: 5 - 10 mTorr to 1 TorrGuage** PECVD: 50 - 500 mTorr to 2 TorrGauge
* Chuck
==Standard Operating Procedure==
* [ System Overview]
* [ ClQBXI80fBwIL1FR48tt7w RIE SOP]
* [ Troubleshooting]
==Checkout Procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through the [https://driveUser Manual Standard Operating Procedure]# Complete Accurately complete the [ SOP quiz]. You may retake as necessary until all answers are correct.# Complete For RIE, complete the training request form [ hereprocess request form].# Create a [{{#var:toolid}} helpdeskticket] ticket requesting traininga checkout session.# A tool engineer Authorization will schedule a time for initial training.# Practice with your mentor or another authorized user until you are comfortable with be provided pending successful completion of the quiz and demonstration of proper tool operation.# Schedule a checkout session with use in the presence of a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors


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