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Sputter deposition

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{{main|Lab 18-2}}
*Materials: [[Aluminum|Al]],[[Chromium|Cr]],[[Gold|Au]],[[Iridium|Ir]],[[Nickel|Ni]],[[Platinum|Pt]],[[Silver|Ag]],[[Titanium|Ti]]
*Lab 18-2 is a loadlocked magnetron sputter tool used for mostly for '''depositing common and precious metals. It uses DC for conductive materials and RF for electrically insulating materials. Deposition rates vary by material but are generally slower for RF depositions. ''' The tool supports 5 materials at a time, rotated using the [|Lab 18-2 Target Change Calendar]
===PVD 75 Sputter Tool===
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