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{{Caution|This system is not for deep silicon etching.}}
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|maintenance = [https://docs.google.com/a/lnf.umich.edu/document/d/1PLT1HXSXWot4gJZBKRx-Dgn0VeV8OguIZgGq5gF8qIw/preview Maintenance]
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The Xactix Xetch X.3.B is a [[Xenon difluoride|xenon difluoride]] etching tool that will etch [[Silicon|silicon]], [[Molybdenum|molybdenum]], and [[Germanium|germanium]] isotropically. XeF<sub>2</sub> is a solid at atmosphere but will sublimate at vacuum. The tool uses two expansion chambers to alternatively sublimate the XeF<sub>2</sub> and release it into the etch chamber. The etch rate is highly dependent on the chamber's loading. A wafer with only a thin trench exposed will etch very fast where as a blanket 100 mm Si wafer may etch as slow as 800 Å/cycle. Wafers are manually loaded directly into the chamber, and the tool can accommodate pieces up to 150 mm wafers.
{{Caution|This system is not for deep silicon etching.}}
* [http://www.xactix.com/XeF2_Unique.pdf Additional Info]
