Changes

GCA AS200 AutoStep

436 bytes removed, 1 year ago

* Automatic reticle (mask) alignment. Automatic wafer handling for 4" wafers

* Atmospheric compensation system controlled to within 0.1 °C

~~===Substrate requirements===~~

* 10 mm pieces up to 6" diameter

* Substrate thicknesses (with existing chucks) 175-675 μm (the range from 400-475 μm thick may not work with existing chucks)

* 4" Si substrates can be autoloaded and prealigned. Various other substrates permitted, but must be manually loaded

* Mounting not necessary unless one is trying to achieve a useable thickness. Make a helpdesk ticket for assistance if needed

===Material restrictions===

OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors

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