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Sputter deposition

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===Lab 18-2===
{{main|Lab 18-2}}
*Materials: [[Aluminum|Al]],[[Chromium|Cr]],[[Gold|Au]],[[Iridium|Ir]],[[Nickel|Ni]],[[Platinum|Pt]],[[Silver|Ag]],[[Titanium|Ti]],[[Tungsten|W]],[[Tungsten:Titanium-9:1|W-Ti]]
*Lab 18-2 is a loadlocked magnetron sputter tool used for mostly for '''depositing common and precious metals.''' The tool supports 5 materials at a time, rotated using the [|Lab 18-2 Target Change Calendar]
===PVD 75 Sputter Tool===
{{main|PVD 75 Proline}}
*Materials deposited: [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Aluminum|Al]], [[Chromium|Cr]], [[Copper|Cu]], [[Cobalt|Co]], [[Iron|Fe]], [[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon dioxide|SiO<sub>2</sub>]], [[Silicon nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Nickel|Ni]], [[Silver|Ag]], [[Titanium|Ti]], [[Tungsten|W]]
*The PVD 75 tool is designed specifically for '''point of use processing of materials not allowed or not currently in the Lab 18 tools.''' It is an open loop (non-loadlocked) tool with easier-to-change targets. Qualified users can change targets when they vent the chamber to load their samples.
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