Changes

[[HeH2|HeH₂]], [[Oxygen|O₂]], [[SF6|SF₆]]

|sop = [https://docs.google.com/a/lnf.umich.edu/document/d/1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8/preview [{{PAGENAME}}#Standard_Operating_Procedure | SOP]|maintenance = [https://docs.google.com/a/lnf.umich.edu/document/d/1OvMzJ2QibI7rEU3ApebmoEPh_nvhBoVxd8NIxHiax0U/preview Maintenance Overview]

The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for [[Reactive ion etching|reactive ion etching (RIE)]] while the right chamber is configured for [[PECVD|plasma enhanced chemical vapor deposition (PECVD)]]. The RIE chamber is significantly slower then than other etchers available in the lab, allowing greater depth control on thin films. The PECVD chamber is also designed to deposit at a lower rate then than the [[GSI PECVD]] and [[P5000 PECVD]] - the smaller building blocks helps help improve film quality. This tool has almost no material restrictions, allowing a wide variety of processing.

** [[Methane|CH₄]] - 18 14 sccm

** [[Tetrafluoromethane|CF₄- 4% O₂]] - 420 sccm

** RIE: 5 - 10 mTorr to 1 TorrGuage** PECVD: 50 - 500 mTorr to 2 TorrGauge

The right chamber has the same restrictions as the left except polymers (such as photoresist) are not allowed unless their melting temperature is significantly higher then than the process temperature (please create a helpdesk ticket for this).

<!-- To include a document from * [https://drive.google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view"com/open?id=1ISeylrCbnE2g8E1acoAKEbNmKXi6CH2f System Overview]* [https://drive.google. com/file/d/0B3k-qgz56T_4RVJqUHp3eEsySUk/view?usp=sharing&resourcekey=0->ClQBXI80fBwIL1FR48tt7w RIE SOP]{{#widget* [https:GoogleDoc|key//drive.google.com/open?id=1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8}}1iWQMtPGj8M9KQmTBJgTBk6jxuMiWCSk4 PECVD SOP]* [https://drive.google.com/open?id=1QiY9Xwt1ucw9axn4JTanLy-OA4QeXEIU Troubleshooting]

# Read through the Standard Operating Procedure User Manual above.# Complete Accurately complete the training request form [https://docs.google.com/a/lnf.umich.edu/forms/d/16kHlwOrAQk_nybzzXjYk78_aENmJiy33jJ7gj18lJKge/1FAIpQLSff-AcfmVpwlCTYKOQVe_sV0Rz_IE_B4vn0Pml7HX3eHcOC2w/viewform hereSOP quiz]. You may retake as necessary until all answers are correct.# For RIE, complete the [https://docs.google.com/forms/d/e/1FAIpQLSf4FcYP1XIoE-scXpXtmaegIzceSVe3uaR8e9P3K3LQAvn20w/viewform process request form].# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdeskticket] ticket requesting traininga checkout session.# A tool engineer Authorization will schedule a time for initial training.# Practice with your mentor or another authorized user until you are comfortable with tool operation.# Complete be provided pending successful completion of the SOP quiz [https://docs.google.com/a/lnf.umich.edu/forms/d/1CBvtjKtkjMqKE0OP6Gm2dIBxlyF-DDZvQTfM4zEgDZc/viewform here].# Schedule a checkout session with a and demonstration of proper tool engineer via use in the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool. ==Maintenance== Every other week presence of a light cleaning is performed on the toolengineer. A 5 min etch with [[Plasmatherm_790/Processes/m_si_o_1|m_si_o_1]] is performed on a 4" oxide wafer as a qualification run. The results can be seen below. {{#widget:Iframe|url=https://docs.google.com/spreadsheets/d/1jDSV00jZ-1vppt2MgGRAJyXRvxEE3rJIlXtngODM9-0/pubchart?oid=947675517&amp;format=interactive |width=700|height=350|border=0}}