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  • ...g|planarizer]] designed for the research and development environment. This CMP has both 4" and 6" capabilities, VIPRR wafer carrier, in-situ pad condition ...working days to set the tool up, test it, and also prepare the SSEC after CMP cleaner, which also has to be configured appropriately.
    7 KB (1,024 words) - 17:17, 18 October 2021
  • CMP Strasbaugh 6EC/Processes

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  • --> {{#vardefine:acronym|CMP}} <!-- |image = CMP.jpg|
    6 KB (894 words) - 11:53, 31 March 2020
  • ...g|planarizer]] designed for the research and development environment. This CMP has both 4" and 6" capabilities, VIPRR wafer carrier, in-situ pad condition ...working days to set the tool up, test it, and also prepare the SSEC after CMP cleaner, which also has to be configured appropriately.
    7 KB (1,024 words) - 17:17, 18 October 2021
  • **CMP Tool **CMP tool - Strasbaugh 6EC
    5 KB (676 words) - 12:11, 25 August 2015
  • CMP Strasbaugh 6EC/Processes
  • Wafers which have been polished using CMP, developed in metal-ion bearing developer (e.g. AZ 400K) or etched in KOH;
    1 KB (199 words) - 11:27, 19 January 2021
  • ===CMP Strasbaugh 6EC=== {{main|CMP Strasbaugh 6EC}}
    6 KB (956 words) - 11:57, 31 March 2020
  • * Wafer (4" and 6" ) cleaning after Si and oxide CMP ...ut of the SSEC is done typically completed together when processing on the CMP
    5 KB (705 words) - 17:27, 18 October 2021
  • ** New Si slurry for the CMP ** CMP Strasbaugh 6EC
    14 KB (2,125 words) - 15:14, 30 March 2018
  • ...s carriers can be transferred into the chuck of the ([[CMP_Strasbaugh_6EC|CMP]]) polisher, allowing the transfer of samples between these tools. * CMP slurry delivering system
    7 KB (973 words) - 16:58, 18 October 2021
  • * After CMP First step cleaning * PFC after CMP
    7 KB (1,098 words) - 14:27, 19 November 2021
  • ...ext to the Flexus stress measurement tool in the main clean room or in the CMP room in the ROBIN lab.
    5 KB (732 words) - 10:08, 27 April 2021
  • ** CMP * CMP Strasbaugh 6EC (limited capability, new chiller will be offline)
    19 KB (3,024 words) - 14:14, 29 April 2019
  • * [[CMP Strasbaugh 6EC]]
    8 KB (1,166 words) - 14:14, 10 November 2021
  • ** CMP
    11 KB (1,619 words) - 10:36, 15 March 2021
  • Post CMP cleaning<br>
    5 KB (749 words) - 11:01, 17 November 2016
  • ...after chemical mechanical polishing in the [[CMP_Strasbaugh_6EC|Strasbaugh CMP]] tool.
    7 KB (1,116 words) - 13:35, 14 April 2020
  • A special case are wafers which have been polished using CMP, developed in metal-ion bearing developer (e.g. AZ 400K) or etched in KOH;
    7 KB (1,161 words) - 13:10, 16 September 2022
  • ...as of the LNF: EECS 1480 (all cleanroom expansion space), EECS 1332 (ROBIN CMP/dicing room) and EECS 1336 (CAD room). '''Space occupancy reservations are
    16 KB (2,556 words) - 17:10, 16 March 2022