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  • ...ication of new and denser integrated circuits without the required capital equipment investment {{note|The film will remain somewhat tacky so it is not well suited to contact alignment.}}
    2 KB (268 words) - 16:32, 8 August 2017
  • ===Lithography, direct writing and mask making=== {{main|Lithography}}
    8 KB (977 words) - 10:18, 25 October 2021
  • |technology = Lithography |names = UV lithography, photolithography
    10 KB (1,476 words) - 16:46, 5 August 2021
  • ...var:acronym|{{PAGENAME}}}} equipment|List of {{#var:acronym|{{PAGENAME}}}} equipment]] ...thograph and e-beam lithography. The LNF also offers Soft and Direct Write Lithography.
    11 KB (1,715 words) - 10:15, 11 August 2021
  • <!-- Set the Process Technology (see subcategories on Equipment page) --> {{#vardefine:technology|Contact lithography}}
    5 KB (651 words) - 09:23, 25 October 2021
  • {{#vardefine:toolid|51000}} {{#vardefine:technology|Lithography}} {{#vardefine:restriction|4}} {{infobox equipment
    4 KB (644 words) - 09:30, 26 October 2021
  • ...ng use of the LNF. If you have more questions or need more details, please contact the LNF managing director [mailto:sandrine@umich.edu sandrine@umich.edu]. ...onics, advanced electronic devices and circuits, organic electronics. Most equipment can handle samples from small pieces up to 150mm diameter samples.
    5 KB (749 words) - 10:01, 17 November 2016
  • Set the Process Technology (see subcategories on Equipment page) --> {{#vardefine:technology|Contact Lithography}} <!--
    4 KB (622 words) - 09:51, 28 September 2021
  • ...In addition, the lab offer a general [[Lithography training session]] for lithography processing including details of process steps and the tools available. This {{em|The following has been moved from [[Optical lithography]] and needs to be integrated into this section}}
    19 KB (2,945 words) - 11:32, 23 March 2021
  • {{#vardefine:toolid|50041}} {{#vardefine:technology|Contact lithography}} {{#vardefine:restriction|4}} {{infobox equipment
    4 KB (567 words) - 10:02, 28 September 2021
  • .../Bond Aligner}} {{#vardefine:toolid|50020}}{{#vardefine:technology|Contact lithography}} {{#vardefine:restriction|2}} {{infobox equipment
    4 KB (665 words) - 17:45, 27 September 2021
  • Set the Process Technology (see subcategories on Equipment page) --> {{#vardefine:technology|Lithography}} <!--
    6 KB (785 words) - 15:41, 30 July 2021
  • Set the Process Technology (see subcategories on Equipment page) --> {{#vardefine:technology|Lithography}} <!--
    8 KB (1,128 words) - 09:21, 25 October 2021
  • Set the Process Technology (see subcategories on Equipment page) --> {{#vardefine:technology|Lithography}} <!--
    5 KB (796 words) - 14:19, 15 August 2022
  • {{#vardefine:toolid|52011}}{{#vardefine:technology|Electron beam lithography}}{{#vardefine:restriction|4}} {{infobox equipment
    9 KB (1,300 words) - 13:59, 25 October 2021
  • --> {{#vardefine:parent|Lithography}} <!-- |equipment = [[Heidelberg µPG 501 Mask Maker]]<br>[[CEE Developer 1]]<br>[[CEE Develo
    7 KB (1,085 words) - 11:27, 23 March 2021
  • {{infobox equipment ...mples. For more information on developing and Lithography please see the [[Lithography training session]]. Processing is done in beakers that are stored on the sh
    6 KB (958 words) - 10:16, 25 October 2021
  • Set the Process Technology (see subcategories on Equipment page) --> {{#vardefine:technology|Lithography}} <!--
    7 KB (963 words) - 13:22, 10 June 2022
  • Set the Process Technology (see subcategories on Equipment page) {{infobox equipment
    5 KB (769 words) - 06:52, 17 December 2021
  • Set the Process Technology (see subcategories on Equipment page) --> {{#vardefine:technology|Lithography}} <!--
    5 KB (759 words) - 16:06, 18 October 2021

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