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  • *This AFM tool has been decommissioned. Please see [[Bruker_ICON_AFM|the wiki page of the current AFM tool]]. * Can measure approximately from 1nm to 6 micron features high features
    4 KB (562 words) - 09:19, 27 April 2021
  • ...pattern can help to define features on the substrate (e.g. etching) or the features can be formed by the deposited pattern. ...(with an e-beam resist), or via physical stamping (no resist needed). The features can be transferred to another layer using techniques such as [[etching]], [
    11 KB (1,715 words) - 10:15, 11 August 2021
  • ...anning meeting which currently takes place '''Tuesdays at 1:30pm''' in the LNF conference room EECS 1340. ...hanges to such processing in the LNF. Additionally, basic training on some features that are used across different tools will be included. This session is only
    4 KB (720 words) - 21:11, 24 August 2015
  • Other related wiki pages ...tip into contact with the sample surface. For the stylus profilometers at LNF, we have 25 μm diameter diamond tip styli.
    4 KB (670 words) - 09:12, 31 March 2020
  • ...ubstrate is essential when device dimensions are comparable to the surface features. Other related wiki pages
    3 KB (479 words) - 10:52, 31 March 2020
  • ...sity of Michigan) users. Due to the current pandemic and its impact on the LNF, the seed program is on hold at this time.<br> ...year, renewable once. Funds are available to the Project Director for any LNF charges (“Lurie Facility Expense”) during the year. Proposals can be s
    7 KB (1,000 words) - 10:07, 30 August 2022
  • |overview = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1UZYJ8unAjQOIJ3nJpa1fwXxYKMyW12k6eDR-A-P6fIE/preview S |sop = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1EPC0U7RQCQLbFe4fL90aMUlLz-fydskqWrUs4hVPpbM/preview S
    8 KB (1,135 words) - 10:35, 23 May 2022
  • The LNF offers several types of exposure, explained in more detail on the [[Lithogr ...d explicitly ''not'' be used, as it will reflow the resist and degrade the features.|error}}
    8 KB (1,140 words) - 09:45, 13 April 2020
  • ...er. For [[Bulk micro-machining]], the entire wafer is dissolved except the features for the device structure. *Overview of Stiction: [https://en.wikipedia.org/wiki/Stiction Wiki article on Stiction]
    7 KB (1,089 words) - 09:04, 28 April 2020