Search results

Jump to navigation Jump to search
Results 1 – 20 of 20
Advanced search

Search in namespaces:

  
  
  
  
  
  
  
  
  
  • ==Processes== ===Deposition Processes===
    1 KB (154 words) - 14:18, 14 January 2021
  • {{#ifeq: {{PMGI SF 6}} | Template | | [[Category:Processes]]}} |technology = Lift-off
    4 KB (547 words) - 16:23, 10 March 2022
  • ...lasma chemistry. All of the processes described here refer to wet chemical processes. ...rnace Clean (or PFC) is used for an [[RCA Clean]] of wafers before furnace processes.
    8 KB (1,216 words) - 14:18, 3 April 2020
  • Remover PG
  • |processes = [[{{PAGENAME}}#Supported_processes|Supported Processes]] **Solvent dump opening: Only solvents with lift-off debris can be dumped into this opening. Do not dump water into this disposa
    5 KB (769 words) - 06:52, 17 December 2021
  • |processes = [[{{PAGENAME}}/Processes|Supported Processes]] *Multi-wafer lift-off evaporator
    8 KB (1,335 words) - 12:51, 5 August 2021
  • |processes = [[Enerjet Evaporator#Supported Processes|Supported Processes]] ...t evaporated films have poor gap fill but make the tool ideal to use for [[lift-off]] applications. The evaporators in the LNF use thin films controllers with
    8 KB (1,165 words) - 07:17, 6 June 2022
  • |processes = [[Cooke Evaporator#Supported Processes|Supported Processes]] *Single wafer lift-off evaporator
    8 KB (1,143 words) - 12:49, 5 August 2021
  • |processes = [[SJ-26 Evaporator#Supported Processes|Supported Processes]] *Multi-wafer lift-off evaporator
    8 KB (1,214 words) - 11:50, 25 February 2020
  • ...Engineering Evovac Thermal-Ebeam Evaporator#Supported Processes|Supported Processes]] ...t evaporated films have poor gap fill but make the tool ideal to use for [[lift-off]] applications. The evaporators in the LNF use thin films controllers with
    9 KB (1,364 words) - 07:21, 6 June 2022
  • {{#ifeq: {{NAMESPACE}} | Template | | [[Category:Processes]]}}
    3 KB (413 words) - 15:32, 6 April 2021
  • .../document/d/1L3rXRgdcpo9_Dmj98XxxhelBG5NMJZLBgATez-ZEz08/preview Supported Processes] |userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]]
    7 KB (1,011 words) - 09:30, 8 October 2021
  • |processes = [[{{PAGENAME}}/Processes|Supported Processes]] |userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]]
    9 KB (1,300 words) - 13:59, 25 October 2021
  • ...an should be used particularly after multiple processing steps. Suggested processes and equipment is listed below. ====Processes====
    8 KB (1,140 words) - 09:45, 13 April 2020
  • |userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]] ...is for working with solvents, [[stripping resist]], cleaning wafers, and [[lift-off]]. It is considered a non CMOS-clean bench, so wafers with metal are allowe
    6 KB (879 words) - 13:39, 1 December 2021
  • ** LAM 9400 Stability and HBr Processes ** SF 6 Lift-off Photoresist for Contact Lithography
    12 KB (1,769 words) - 07:56, 14 September 2022
  • ...page. For detailed information on optical lithography practices and common processes, see the [https://docs.google.com/document/d/1lwKiyFrUNtZ2j9MNi21j697glr_Yw ...an should be used particularly after multiple processing steps. Suggested processes and equipment is listed below.
    19 KB (2,945 words) - 11:32, 23 March 2021
  • Both dry and wet etching with a wide range of characterized processes and recipes are available at the LNF to transfer the desired pattern onto y *[[Lift-off]]
    8 KB (977 words) - 10:18, 25 October 2021
  • ...metal films. Low substrate temp. Directionality means it works well with lift-off patterning ...odeposition does not require a vacuum environment and can be done in batch processes, thus making it relatively inexpensive. It creates a thick, durable film wh
    10 KB (1,417 words) - 08:05, 1 May 2020
  • *[[Lift-off]] processing of metals and some dielectrics *Processes where directional coatings are desirable
    12 KB (1,886 words) - 10:08, 14 April 2020