Spinner CEE Apogee

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Spinner CEE Apogee
Equipment Details
Technology Lithography
Materials Restriction General
Material Processed Photoresist
Sample Size pieces up to 6" wafers
Chemicals Used Acetone, IPA
Equipment Manual
Operating Procedure SOP
Maintenance Maintenance

The Spinner CEE Apogee is a fully programmable, manual dispense, photoresist spinner located in the main cleanroom at the LNF. It can accept pieces, 4" and 6" wafers. It is located in 1440C.


PMMA and other e-beam resists should be processed in Photoresist Bench 21 in 1480A
Any other non standard photoresist must have direct approval of tool owner
SU-8 may only be processed in the ROBIN lab

System Overview

Hardware Details

  • Up to 6K rpm spin rates
  • Hot plate maintained at 115°C

Substrate Requirements

  • From 10x10 mm pieces up to 150 mm (6 inch) wafers
  • No substrate material requirements
  • Available Chucks
    • 6" Chuck (Ø 3.75")
    • 4" Chuck (Ø 2.25")
    • Large Piece Chuck (Ø 0.75")
    • Small Piece Chuck (Ø 0.25" - chuck ; Ø 0.375" - O-ring)
Please choose a chuck sized appropriately for your sample. Your sample must fully cover the top surface of the chuck to prevent photoresist from being sucked into the vacuum hole. The tools may be damaged if photoresist or solvent goes into the vacuum hole in the spindle. Incorrect chuck use will result in loss of tool access.

Material Restrictions

The Spinner CEE Apogee is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported Processes

There are 10 recipe slots in the software, used as follows:

  • 8 fixed spin recipes, 1 stripping recipe, 1 custom recipe
    • 4 recipes (1000-4000 rpm) for thin resists (e.g. SPR 220 3.0)
    • 4 recipes (1000-4000 rpm) for thick resists (e.g. KMPR 1010)
  • Only the Custom recipe is allowed to be changed. Instructions on how to do so can be found in the SOP.

More information on the recipe details can be found in the Supported Processing section of the Equipment Manual. For more information on photoresist spinning and recommended lithography processes, please read the Lithography page. For information on a specific photoresist, please check the datasheet.

Standard Operating Procedure

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Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Take the online training and read through the SOP.
  3. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
  4. Schedule a time for a checkout:
    1. Find an available time for checkout here.
    2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
    3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
  5. Create a helpdesk ticket for final confirmation of your checkout appointment.
  6. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.


The bowl, chucks, and hotplate are cleaned each week during lab clean. The protective lining in the bowl is replaced as necessary.

User authorized maintenance

In the event of a power bump, users may run the turn the tool on using the power button.