Difference between revisions of "Sputter deposition"
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**[[Titanium dioxide|Titanium dioxide(TiO2)]] | **[[Titanium dioxide|Titanium dioxide(TiO2)]] | ||
**[[Zinc|Zinc(Zn)]] | **[[Zinc|Zinc(Zn)]] | ||
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| + | ===Lab 18-1=== | ||
| + | {{main|Lab 18-1}} | ||
| + | *Materials Deposited: [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Indium-Tin-Oxide|ITO]], [[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Tantalum|Ta]], [[Tantalum|Ta<sub>2</sub>O<sub>5</sub>]], [[Titanium|Ti]], [[Titanium Dioxide|TiO<sub>2</sub>]] | ||
| + | *Lab 18-1 is a loadlocked magnetron sputter tool used for depositing metals, insulators, optical and semiconductive films. It has a variable-gated turbo pump and more sensitive gas flows that allow it to run more sensitive gas ratios (<1%) for reactive sputtering. It has a DC supply for conductive materials and RF supplies for electrically insulating materials. Deposition rates vary by material but are generally mich slower for RF depositions. The tool supports 5 materials at a time, rotated using the [https://docs.google.com/a/lnf.umich.edu/spreadsheet/ccc?key=0AsWeTTMTotIfdExOSHBhSVQ4dUpyRFFpWE5icEMwZlE#gid=23|Lab 18-1 Target Change Calendar] | ||
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| + | ===Lab 18-2=== | ||
| + | {{main|Lab 18-2}} | ||
| + | *Materials: [[Aluminum|Al]],[[Chromium|Cr]],[[Copper|Cu]],[[Gold|Au]],[[Germanium|Ge]],[[Iridium|Ir]],[[Nickel|Ni]],[[Nickel-Chromium|NiCr]],[[Platinum|Pt]],[[Silicon|Si]],[[Silver|Ag]],[[Titanium|Ti]] | ||
| + | *Lab 18-2 is a loadlocked magnetron sputter tool used for mostly for depositing metals. It uses DC for conductive materials and RF for electrically insulating materials. Deposition rates vary by material but are generally slower for RF depositions. The tool supports 5 materials at a time, rotated using the [https://docs.google.com/a/lnf.umich.edu/spreadsheet/ccc?key=0AsWeTTMTotIfdGxLMlpVZm1NSlF0SDJMU3hvRFctR1E#gid=13|Lab 18-2 Target Change Calendar] | ||
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| + | ===Denton Explorer=== | ||
| + | {{main|Denton Explorer}} | ||
| + | *The Denton Explorer is an open-loop 2-source magnetron sputter tool used as a Lab 18 backup for depositing metal films | ||
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| + | ===AMS 2004 Aluminum Nitride Sputter Tool=== | ||
| + | {{main|AMS 2004 Aluminum Nitride Sputter Tool}} | ||
| + | *Materials deposited: AlN, Al | ||
| + | *The AMS tool is designed specifically for Piezoelectric AlN on 4" wafers. It is a high temperature process that works only on certain substrates with specific seeding matetrials and the handler is only designed for 4" wafers are this time. | ||
==References== | ==References== | ||
*[[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition]] | *[[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition]] | ||
Revision as of 12:09, 15 January 2016
| Sputter deposition | |
|---|---|
 | |
| Equipment Details | |
| Technology | PVD |
| Materials Restriction | Metals |
| Material Processed | Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, Ni, Pt, SiO2, Ti, TiO2, Zn |
| Sample Size | 6", 4", 3" and 2" wafers, Pieces |
| Gases Used | Ar, N2, O2 1%, O2 0.1% |
| Equipment Manual | |
| Overview | General Overview: Wikipedia Sputter Deposition |
 Warning: | This page has not been released yet. |
Sputter Deposition is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically Ar.) The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
Contents
LNF Capabilities
- The LNF has 4 Sputter Deposition Tools
- The following materials can be deposited using Magnetron Sputter Deposition.
Lab 18-1
Main article: Lab 18-1
- Materials Deposited: Al2O3, ITO, Mo, Si, SiO2, Si3N4, Ta, Ta2O5, Ti, TiO2
- Lab 18-1 is a loadlocked magnetron sputter tool used for depositing metals, insulators, optical and semiconductive films. It has a variable-gated turbo pump and more sensitive gas flows that allow it to run more sensitive gas ratios (<1%) for reactive sputtering. It has a DC supply for conductive materials and RF supplies for electrically insulating materials. Deposition rates vary by material but are generally mich slower for RF depositions. The tool supports 5 materials at a time, rotated using the 18-1 Target Change Calendar
Lab 18-2
Main article: Lab 18-2
- Materials: Al,Cr,Cu,Au,Ge,Ir,Ni,NiCr,Pt,Si,Ag,Ti
- Lab 18-2 is a loadlocked magnetron sputter tool used for mostly for depositing metals. It uses DC for conductive materials and RF for electrically insulating materials. Deposition rates vary by material but are generally slower for RF depositions. The tool supports 5 materials at a time, rotated using the 18-2 Target Change Calendar
Denton Explorer
Main article: Denton Explorer
- The Denton Explorer is an open-loop 2-source magnetron sputter tool used as a Lab 18 backup for depositing metal films
AMS 2004 Aluminum Nitride Sputter Tool
Main article: AMS 2004 Aluminum Nitride Sputter Tool
- Materials deposited: AlN, Al
- The AMS tool is designed specifically for Piezoelectric AlN on 4" wafers. It is a high temperature process that works only on certain substrates with specific seeding matetrials and the handler is only designed for 4" wafers are this time.
