Difference between revisions of "Sputter deposition"

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|overview =  [[Wikipedia:Electron_beam_physical_vapor_deposition|Electron Beam Physical Vapor Deposition General Overview]]
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|overview =  [[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition]]
 
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==References==
 
==References==
*[[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition ]]
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*[[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition]]

Revision as of 09:47, 10 July 2015



Sputter deposition
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, In, MgF, Ni, NiCr, Pt, Sn, SiO2, SiO, Ti, TiO2, Zn, ZnSe
Sample Size 4", 3" and 2" wafers, pieces
Equipment Manual
Overview General Overview: Wikipedia Sputter Deposition


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Electron Beam Evaporation is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a tungsten filament under high vacuum. The accelerated electrons strike the target and melt/sublimate the material to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.

LNF Capabilities



References