Sputter deposition

Sputter deposition
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Equipment Details
Technology	PVD
Materials Restriction	Metals
Material Processed	Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, Ni, Pt, SiO2, Ti, TiO2, Zn
Sample Size	6", 4", 3" and 2" wafers, Pieces
Gases Used	Ar, N2, O2 1%, O2 0.1%
Equipment Manual
Overview	General Overview: Wikipedia Sputter Deposition

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Sputter Deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). The sputtered ions (typically only a small fraction of the ejected particles are ionized — on the order of 1%) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing resputtering).

LNF Capabilities

• The LNF has 4 Sputter Deposition Tools
  • Lab 18-1
  • Lab 18-2
  • AMS 2004 Aluminum Nitride Sputter Tool
  • Denton Explorer-14

• The Following Materials can be deposited using Electron Beam Evaporation
  • Aluminum(Al)
  • Aluminum oxide(Al2O3)
  • Chromium(Cr)
  • Copper(Cu)
  • Gold (Au)
  • Germanium(Ge)
  • Iron(Fe)
  • Nickel (Ni)
  • Platinum(Pt)
  • Silicon dioxide(SiO2)
  • Silicon nitride(SiN)
  • Silver(Ag)
  • Titanium(Ti)
  • Titanium dioxide(TiO2)
  • Zinc(Zn)

References

• General Overview: Wikipedia Sputter Deposition