Difference between revisions of "Sputter deposition"
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| − | [[Wikipedia:Sputter_deposition|Sputter Deposition]] is a physical vapor deposition (PVD) method of thin film deposition | + | [[Wikipedia:Sputter_deposition|Sputter Deposition]] is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a target) is subjected to a gas plasma (typically Ar.) The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film. |
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==LNF Capabilities== | ==LNF Capabilities== | ||
Revision as of 10:45, 6 January 2016
| Sputter deposition | |
|---|---|
 | |
| Equipment Details | |
| Technology | PVD |
| Materials Restriction | Metals |
| Material Processed | Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, Ni, Pt, SiO2, Ti, TiO2, Zn |
| Sample Size | 6", 4", 3" and 2" wafers, Pieces |
| Gases Used | Ar, N2, O2 1%, O2 0.1% |
| Equipment Manual | |
| Overview | General Overview: Wikipedia Sputter Deposition |
 Warning: | This page has not been released yet. |
Sputter Deposition is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a target) is subjected to a gas plasma (typically Ar.) The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
LNF Capabilities
- The LNF has 4 Sputter Deposition Tools
- The following materials can be deposited using Magnetron Sputter Deposition.
