Difference between revisions of "Sputter deposition"

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|image = [[File:Sputter Deposition.png|center|300px]]
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|image = Sputter Deposition.png
 
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|materials = [[Silver|Ag]], [[Aluminum|Al]], [[Aluminum oxide|Al2O3]], [[Gold|Au]], [[Chromium|Cr]], [[Copper|Cu]], [[Iron|Fe]], [[Germanium|Ge]], [[Nickel|Ni]], [[Platinum|Pt]], [[Silicon dioxide|SiO2]], [[Titanium|Ti]], [[Titanium dioxide|TiO2]], [[Zinc|Zn]]
 
|materials = [[Silver|Ag]], [[Aluminum|Al]], [[Aluminum oxide|Al2O3]], [[Gold|Au]], [[Chromium|Cr]], [[Copper|Cu]], [[Iron|Fe]], [[Germanium|Ge]], [[Nickel|Ni]], [[Platinum|Pt]], [[Silicon dioxide|SiO2]], [[Titanium|Ti]], [[Titanium dioxide|TiO2]], [[Zinc|Zn]]
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[[Wikipedia:Sputter_deposition|Sputter Deposition]] is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically Ar.)    The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
 
[[Wikipedia:Sputter_deposition|Sputter Deposition]] is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically Ar.)    The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.

Revision as of 11:50, 6 January 2016

Capabilities


Sputter deposition
Sputter Deposition.png
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, Ni, Pt, SiO2, Ti, TiO2, Zn
Sample Size 6", 4", 3" and 2" wafers, Pieces
Gases Used Ar, N2, O2 1%, O2 0.1%
Equipment Manual
Overview General Overview: Wikipedia Sputter Deposition


Warning Warning: This page has not been released yet.

Sputter Deposition is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically Ar.) The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.


LNF Capabilities


References