Difference between revisions of "Sputter deposition"

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*[[Wikipedia:Electron_beam_physical_vapor_deposition|General Overview: Wikipedia Electron Beam Physical Vapor Deposition ]]
*[[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition ]]

Revision as of 10:25, 10 July 2015

Sputter deposition
Electron Beam Evaporation.jpg
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, In, MgF, Ni, NiCr, Pd, Pt, Sn, SiO2, SiO, Ti, TiO2, Zn, ZnSe
Sample Size 4", 3" and 2" wafers, pieces
Equipment Manual
Overview Electron Beam Physical Vapor Deposition General Overview

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Electron Beam Evaporation is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a tungsten filament under high vacuum. The accelerated electrons strike the target and melt/sublimate the material to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.

LNF Capabilities