Difference between revisions of "Sputter deposition"
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Revision as of 09:45, 10 July 2015
| Sputter deposition | |
|---|---|
| Equipment Details | |
| Technology | PVD |
| Materials Restriction | Metals |
| Material Processed | Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, In, MgF, Ni, NiCr, Pt, Sn, SiO2, SiO, Ti, TiO2, Zn, ZnSe |
| Sample Size | 4", 3" and 2" wafers, pieces |
| Equipment Manual | |
| Overview | Electron Beam Physical Vapor Deposition General Overview |
 Warning: | This page has not been released yet. |
Electron Beam Evaporation is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a tungsten filament under high vacuum. The accelerated electrons strike the target and melt/sublimate the material to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.
LNF Capabilities
- The LNF has 4 E-Beam Evaporators
- The Following Materials can be deposited using Electron Beam Evaporation
- Aluminum(Al)
- Aluminum oxide(Al2O3)
- Chromium(Cr)
- Copper(Cu)
- Gold (Au)
- Germanium(Ge)
- Indium(In)
- Iron(Fe)
- Magnesium flouride (MgF)
- Nickel (Ni)
- Nichrome (NiCr)
- Palladium(Pd)
- Platinum(Pt)
- Silicon dioxide(SiO2)
- Silicon monoxide(SiO)
- Silver(Ag)
- Tin(Sn)
- Titanium(Ti)
- Titanium dioxide(TiO2)
- Zinc(Zn)
- Zinc selenide(ZnSe)
