Sputter deposition

Sputter deposition
Equipment Details
Technology	PVD
Materials Restriction	Metals
Material Processed	Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, In, MgF, Ni, NiCr, Pd, Pt, Sn, SiO2, SiO, Ti, TiO2, Zn, ZnSe
Sample Size	4", 3" and 2" wafers, pieces
Equipment Manual
Overview	Electron Beam Physical Vapor Deposition General Overview

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Electron Beam Evaporation is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a tungsten filament under high vacuum. The accelerated electrons strike the target and melt/sublimate the material to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.

LNF Capabilities

• The LNF has 4 E-Beam Evaporators
  • Enerjet Evaporator
  • Cooke Evaporator
  • SJ-20 Evaporator
  • SJ-26 Evaporator

• The Following Materials can be deposited using Electron Beam Evaporation
  • Aluminum(Al)
  • Aluminum oxide(Al2O3)
  • Chromium(Cr)
  • Copper(Cu)
  • Gold (Au)
  • Germanium(Ge)
  • Indium(In)
  • Iron(Fe)
  • Magnesium flouride (MgF)
  • Nickel (Ni)
  • Nichrome (NiCr)
  • Palladium(Pd)
  • Platinum(Pt)
  • Silicon dioxide(SiO2)
  • Silicon monoxide(SiO)
  • Silver(Ag)
  • Tin(Sn)
  • Titanium(Ti)
  • Titanium dioxide(TiO2)
  • Zinc(Zn)
  • Zinc selenide(ZnSe)

References

• General Overview: Wikipedia Sputter Deposition