Sputter deposition

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Sputter deposition
|center|300px][File:Sputter Deposition.png|center|300px]]
Equipment Details
Technology	PVD
Materials Restriction	Metals
Material Processed	Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, Ni, Pt, SiO2, Ti, TiO2, Zn
Sample Size	6", 4", 3" and 2" wafers, Pieces
Gases Used	Ar, N2, O2 1%, O2 0.1%
Equipment Manual
Overview	General Overview: Wikipedia Sputter Deposition

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Sputter Deposition is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a target) is subjected to a gas plasma (typically Ar.) The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.

LNF Capabilities

• The LNF has 4 Sputter Deposition Tools
  • Lab 18-1
  • Lab 18-2
  • AMS 2004 Aluminum Nitride Sputter Tool
  • Denton Explorer-14

• The following materials can be deposited using Magnetron Sputter Deposition.
  • Aluminum(Al)
  • Aluminum oxide(Al2O3)
  • Chromium(Cr)
  • Copper(Cu)
  • Gold (Au)
  • Germanium(Ge)
  • Iron(Fe)
  • Nickel (Ni)
  • Platinum(Pt)
  • Silicon dioxide(SiO2)
  • Silicon nitride(SiN)
  • Silver(Ag)
  • Titanium(Ti)
  • Titanium dioxide(TiO2)
  • Zinc(Zn)

References

• General Overview: Wikipedia Sputter Deposition