|Material Processed||Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, Ni, Pt, SiO2, Ti, TiO2, Zn|
|Sample Size||6", 4", 3" and 2" wafers, Pieces|
|Gases Used||Ar, N2, O2 1%, O2 0.1%|
|Overview||General Overview: Wikipedia Sputter Deposition|
|Warning:||This page has not been released yet.|
Sputter Deposition is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically Ar.) The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
- The LNF has 4 Sputter Deposition Tools