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Sputter deposition
Sputter Deposition.png
|center|300px][File:Sputter Deposition.png|center|300px]]
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Ag, Al, Al2O3, Au, Cr, Cu, Fe, Ge, Ni, Pt, SiO2, Ti, TiO2, Zn
Sample Size 6", 4", 3" and 2" wafers, Pieces
Gases Used Ar, N2, O2 1%, O2 0.1%
Equipment Manual
Overview General Overview: Wikipedia Sputter Deposition


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Sputter Deposition is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically Ar.) The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.


LNF Capabilities

References