Substrate bonding

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Wafer bonding refers to attaching two or more substrates of material such as glass or silicon, to each other by means of various chemical and physical effects. Wafer bonding is mainly used in MEMS, where sensor components are encapsulated in the application. The most common types of wafer bonding are adhesive, anodic, eutectic, fusion, glass frit, and metalic diffusion.

Technologies

Here is where you describe technologies within the group.

Adhesive bonding

Main article: Adhesive bonding

Uses a layer of polymer or adhesive, including epoxies, dry films, BCB, polyimides, and UV curable compounds between the substrates to bond the substrates together. This introduces a foreign material between your substrates, but there is a wide variety of materials that can make this method desirable for it's extremely wide range of temperature and control.

Anodic bonding

Main article: Anodic bonding

involves encapsulating components on the wafer by means of ionic glass.

Technology 3

Main article: Eutectic bonding

Here's another technology in that group.

Technology 4

Main article: Fusion bonding

Here's another technology in that group.

Technology 5

Main article: Glass frit bonding

Here's another technology in that group.

Technology 6

Main article: Metallic diffusion bonding

Here's another technology in that group.

Figures of Merit

What is important to look for in the technology? Etch/dep rate? Resolution?

FOM 1

Subheadings are optional.

Applications

How is this technology used in nanofabrication and what types of devices/research areas is it useful in?

Equipment

Specific equipment for each technology can be found on its page above. Additionally, below is a list of all metrology equipment in the LNF:

See also

Other related wiki pages

Further reading

• Other stuff, e.g. technology workshop slides
• External links (can be in another section below, if appropriate)