Difference between revisions of "Substrate bonding"
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Revision as of 16:07, 25 January 2016
Wafer bonding refers to attaching two or more substrates of material such as glass or silicon, to each other by means of various chemical and physical effects. Wafer bonding is mainly used in MEMS, where sensor components are encapsulated in the application. The most common types of wafer bonding are adhesive, anodic, eutectic, fusion, glass frit, and metalic diffusion.
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Template:Adhesive bonding Uses a layer of polymer or adhesive, including epoxies, dry films, BCB, polyimides, and UV curable compounds between the substrates to bond the substrates together. This introduces a foreign material between your substrates, but there is a wide variety of materials that can make this method desirable for it's extremely wide range of temperature and control.
Template:Anodic bonding Here's another technology in that group.
Template:Eutectic bonding Here's another technology in that group.
Template:Fusion bonding Here's another technology in that group.
Template:Glass frit Here's another technology in that group.
Template:Metallic diffusion bonding Here's another technology in that group.
Figures of Merit
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Specific equipment for each technology can be found on its page above. Additionally, below is a list of all metrology equipment in the LNF:
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