Difference between revisions of "Substrate bonding"
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[[{{Packaging/Mechanical}}]] is... | [[{{Packaging/Mechanical}}]] is... | ||
| − | + | Substrate bonding refers to attaching two or more substrates of material such as glass or silicon, to each other by means of various chemical and physical effects. Substrate bonding is mainly used in MEMS, where sensor components are encapsulated in the application. The most common types of bonding are adhesive, anodic, eutectic, fusion, glass frit, direct wafer or fusion bonding, and metallic diffusion. | |
==Technologies== | ==Technologies== | ||
| − | + | There are 7 primary methods which define substrate bonding technology. These have been mentioned above and are described in detail below. | |
===Adhesive bonding=== | ===Adhesive bonding=== | ||
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===Technology 6=== | ===Technology 6=== | ||
{{main|Metallic diffusion bonding}} | {{main|Metallic diffusion bonding}} | ||
| + | Here's another technology in that group. | ||
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| + | ===Technology 7=== | ||
| + | {{main|direct wafer (fusion) bonding}} | ||
Here's another technology in that group. | Here's another technology in that group. | ||
Revision as of 10:48, 28 January 2016
Template:Packaging/Mechanical[:Template:Packaging/Mechanical]][:Template:Packaging/Mechanical]] is...
Substrate bonding refers to attaching two or more substrates of material such as glass or silicon, to each other by means of various chemical and physical effects. Substrate bonding is mainly used in MEMS, where sensor components are encapsulated in the application. The most common types of bonding are adhesive, anodic, eutectic, fusion, glass frit, direct wafer or fusion bonding, and metallic diffusion.
Contents
Technologies
There are 7 primary methods which define substrate bonding technology. These have been mentioned above and are described in detail below.
Adhesive bonding
Uses a layer of polymer or adhesive, including epoxies, dry films, BCB, polyimides, and UV curable compounds between the substrates to bond the substrates together. This introduces a foreign material between your substrates, but there is a wide variety of materials that can make this method desirable for it's extremely wide range of temperature and control.
Anodic bonding
involves encapsulating components on the wafer by means of ionic glass.
Technology 3
Here's another technology in that group.
Technology 4
Here's another technology in that group.
Technology 5
Here's another technology in that group.
Technology 6
Here's another technology in that group.
Technology 7
Here's another technology in that group.
Figures of Merit
What is important to look for in the technology? Etch/dep rate? Resolution?
FOM 1
Subheadings are optional.
Applications
How is this technology used in nanofabrication and what types of devices/research areas is it useful in?
Equipment
Specific equipment for each technology can be found on its page above. Additionally, below is a list of all metrology equipment in the LNF:
See also
Other related wiki pages
References
Further reading
- Other stuff, e.g. technology workshop slides
- External links (can be in another section below, if appropriate)
