Difference between revisions of "Tempress S1T1 - Annealing"
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==Checkout procedure== | ==Checkout procedure== | ||
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Help desk Ticket] requesting training. | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Help desk Ticket] requesting training. | ||
| − | # | + | # LNF staff will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out. |
| − | # Schedule a checkout session with a tool engineer via the | + | # Schedule a checkout session with a tool engineer via the existing Helpdesk ticket. If this checkout is successful, the engineer will authorize you on the tool. |
==Maintenance== | ==Maintenance== | ||
Revision as of 09:18, 19 October 2021
| Tempress S1T1 - Annealing | |
|---|---|
 | |
| Equipment Details | |
| Technology | Thermal processing |
| Materials Restriction | CMOS Clean |
| Sample Size | Pieces up to 150 mm (6") |
| Gases Used | N2, 5%H2/N2 |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Annealing |
| Maintenance | Maintenance |
The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Annealing in metallurgy, and material science, is a heat treatment wherein, a material is altered, causing a change in its properties such as strength, and hardness. It is a process that produces conditions by heating, and maintaining a suitable temperature, and then cooling. Annealing is used to induce softness, relieve internal stress, and to refine the structure.
Contents
Announcements
- There are no announcements at this time.
Capabilities
System overview
Hardware details
Substrate requirements
- Silicon only
- Pieces up to 150mm (6")
- Can process up to 25, 100mm (4"), and or, 150mm (6") wafers
- Wafer thickness, 525um for 100mm (4"), and 675um for 150mm (6")
Material restrictions
The Tempress S1T1 - Annealing is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
Process details
Characterization data
- N/A
Standard operating procedure
Checkout procedure
- Create a Help desk Ticket requesting training.
- LNF staff will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
- Schedule a checkout session with a tool engineer via the existing Helpdesk ticket. If this checkout is successful, the engineer will authorize you on the tool.
