Difference between revisions of "Tempress S1T1 - Annealing"

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==Checkout procedure==
 
==Checkout procedure==
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Help desk Ticket] requesting training.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Help desk Ticket] requesting training.
# A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
+
# LNF staff will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
# Schedule a checkout session with a tool engineer via the [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Help desk Ticket] system. If this checkout is successful, the engineer will authorize you on the tool.
+
# Schedule a checkout session with a tool engineer via the existing Helpdesk ticket. If this checkout is successful, the engineer will authorize you on the tool.
  
 
==Maintenance==
 
==Maintenance==

Revision as of 10:18, 19 October 2021

Tempress S1T1 - Annealing
40051.jpg
Equipment Details
Technology Thermal processing
Materials Restriction CMOS Clean
Sample Size Pieces up to 150 mm (6")
Gases Used N2, 5%H2/N2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Annealing
Maintenance Maintenance


The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Annealing in metallurgy, and material science, is a heat treatment wherein, a material is altered, causing a change in its properties such as strength, and hardness. It is a process that produces conditions by heating, and maintaining a suitable temperature, and then cooling. Annealing is used to induce softness, relieve internal stress, and to refine the structure.

Announcements

  • There are no announcements at this time.

Capabilities

System overview

Hardware details

  • N2 - Maximum flow 10 slpm
  • 5% H2/N2 - Maximum flow 10 slpm
  • Maximum temperature 600°C

Substrate requirements

  • Silicon only
  • Pieces up to 150mm (6")
  • Can process up to 25, 100mm (4"), and or, 150mm (6") wafers
  • Wafer thickness, 525um for 100mm (4"), and 675um for 150mm (6")

Material restrictions

The Tempress S1T1 - Annealing is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

Process details

Characterization data

  • N/A

Standard operating procedure

Checkout procedure

  1. Create a Help desk Ticket requesting training.
  2. LNF staff will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
  3. Schedule a checkout session with a tool engineer via the existing Helpdesk ticket. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance