Tempress S1T2 - LTO 4"

Tempress S1T2 - LTO 4"
Equipment Details
Technology	LPCVD
Materials Restriction	CMOS Clean
Sample Size	Pieces up to 100 mm (4")
Gases Used	N2, O2, SiH4
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	LTO
Maintenance	Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. LTO is formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure.

Announcements

• There are no announcements at this time.

Capabilities

• LTO - Low Temperature Oxide
• Maximum Thickness - 12 µm

System Overview

Hardware Details

• N₂ - Maximum flow 1 slpm
• N₂ - Maximum flow 10 slpm
• O₂ - Maximum flow 500 sccm
• SiH₄ - Maximum flow 100 sccm

Substrate Requirements

• Silicon only
• Pieces up to 100 mm (4")
• Can process up to 25, 100 mm (4") wafers

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material Restrictions

The Tempress S1T2 - LTO 4" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

• LTO (Low Temperature Oxide)

Process Details

• Process recipe overview

Characterization Data

• LTO

Standard Operating Procedure

• Quick reference SOP

Checkout Procedure

1. Create a Help desk Ticket requesting training.
2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Maintenance is performed on the tool, after 30-40 µm of accumulated deposition.
• Maintenance consists of replacing the following quartz parts within the tube.
  • Cage
  • Twin rods
  • Bridge for twin rods
  • Thermocouple sheath
  • SiH₄ injector
  • O₂ injector
  • Dummy wafers